DGC ZM-DGC900, Manual, Page: 3 / 31

A. Company Profile
DGC as quality control specialist in China started operations since 2007, with the Union of
intelligent human resources from China and Overseas, it has since then paved the way for Chinese
brand best products in outside markets, also promote and develop strategies for different products
according to languages and needs have been basic in DGC objectives. DGC now is involved
directly in the production of different lines for specific markets according to the conclusion of the
studies about each field, and the real needs for those.
Shenzhen Machine Co., Ltd. is located in one of the most prosperous parts—Xixiang, with
Shenzhen International Airport to its south and State Hwy. 107 as well as Shenzhen-Guangzhou
Superhighway to its north, enjoying convenient transportation.
Shenzhen Zhuomao Co., Ltd. aims to expand the market with advanced thinking and
pioneering philosophy; seizes the market with strong technical expertise; ensures the high quality of
the products with modern scientific management and mature advanced technology; and offers our
clients the best service with perfect sales network and high-quality staff.
We sincerely hope that our products will bring you more and more profits and wealth.
B. BGA Rework Station
1. Knowledge about BGA
BGA is short for Ball Grid Array. It is a kind of package method which use organic carrier in IC. It
has the following features:
Small
①
package area. Greater functions and more pins.
②
Self ③ -centerize while PCB puddle welding, easy to put on tin. More reliable. ④
Good conductivity and low overall cost. ⑤
Memory which applies BGA can enlarge the memory capacity by 2 to 3 times
while the volume of memory remains the same. Compared with TSOP, BGA is much
smaller and better at radiating and conducting electricity.
2. Types and Features of BGA
a. Types
According to the encapsulation material, BGA can be classified into the following types:
(1)PBGA
（
Plastic BGA
）
(2)CBGA （ Ceramic BGA ）
(3)CCBGA （ Ceramic Column BGA ）
(4)TBGA
（
Tape BGA
）
(5)CSP (Chip Scale Package or MBGA)
b. Features
Compared with QFP, BGA has the following features:
(1)
I/O terminal space is big (eg. 1.0mm, 1.27mm, 1.5mm), and it can accommodate
more I/O.
(2)
More reliable package, low rate of welding defects and welding spot durable.
(3) Paraposition of QFP is usually observed with naked eyes. When the pin space is
smaller than 0.4mm, it is hard to paraposition and weld. While the pin space of
BGA is bigger, by applying the paraposition-amplification device, it is easy to
paraposition and weld.
(4)
The welding coplanarity of BGA is better than QFP, because solder can make up
the flat error between BGA and PCB after melting.
(5)Good electrical property. The pins are small, the selfinductance and mutualinductance
of the conductivity is low, and the frequency characteristic is good.
3