PIC
The parts used:
•
Heat-dissipation module x1
•
Thermal pad x2
Guide:
1. Split plastic films on both
sides of the thermal pad.
2. Fit the thermal pads on
these two positions
indicated with red frame
lines.
Fit Thermal Pad
Assembly
02
4
These two main heating source on
the board are the CPU and the
power management chip.
Summary of Contents for FIT0677
Page 27: ...Done 27 Assembly 02 ...
Page 30: ...3 Thank You 2021 05 18 30 ...
