Dell
PowerEdge M710HD Technical Guide
iii
Table of Contents
1
Product Comparison ........................................................................................... 6
1.1
Overview .................................................................................................. 6
1.2
Rack-Dense Performance ............................................................................... 6
1.3
Efficiency Without Compromise........................................................................ 6
1.4
Enterprise-Class Reliability and Management ........................................................ 6
1.5
Comparison ............................................................................................... 7
2
Key Technologies ............................................................................................... 9
2.1
Overview .................................................................................................. 9
2.2
Dual Intel Xeon Quad-Core and Six-Core Processors ................................................ 9
2.3
DDR3 Memory ............................................................................................. 9
2.4
PCI Express Generation 2 ............................................................................... 9
2.5
Network Daughtercard .................................................................................. 9
2.6
Redundant Internal SD Module ......................................................................... 9
2.7
iDRAC6 Enterprise ........................................................................................ 9
3
System Information .......................................................................................... 10
3.1
Overview ................................................................................................ 10
3.2
Product Features Summary ........................................................................... 10
4
Mechanical .................................................................................................... 13
4.1
Chassis Description..................................................................................... 13
4.2
Dimensions and Weight ................................................................................ 13
4.3
Internal Module ......................................................................................... 13
4.4
Security .................................................................................................. 14
4.5
Cover Latch ............................................................................................. 14
4.6
TPM (Trusted Platform Module) ...................................................................... 14
4.7
Power Off Security ..................................................................................... 14
4.8
iDRAC6 Security Features ............................................................................. 14
4.9
USB ....................................................................................................... 15
4.10
Battery ................................................................................................... 15
4.11
Field Replaceable Units (FRU)........................................................................ 15
4.12
User Accessible Jumpers, Sockets, and Connectors ............................................... 15
5
Power, Thermal, Acoustic .................................................................................. 16
5.1
Power Supplies ......................................................................................... 16
5.2
Power Efficiency ....................................................................................... 16
5.3
Thermal Operating and Storage Specifications .................................................... 16
5.4
Acoustics ................................................................................................ 17
5.5
Thermal.................................................................................................. 18
6
Processors ..................................................................................................... 19
6.1
Overview ................................................................................................ 19
6.2
Features ................................................................................................. 19
6.3
Supported Processors .................................................................................. 20
6.4
Processor Installation .................................................................................. 21
7
Memory ........................................................................................................ 22
7.1
Overview ................................................................................................ 22
7.2
DIMMs Supported ....................................................................................... 23
7.3
DIMM Slots ............................................................................................... 23
7.4
Speed .................................................................................................... 23
8
Chipset ........................................................................................................ 25
8.1
Overview ................................................................................................ 25
