System component description
39
Overview
shows the three status LEDs on the power supply/cooling module.
The enclosure cooling system consists of dual-blower modules in each power
supply/cooling module.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DAE disk drives. The VNXe3100 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
2U, 12 (3.5-inch) DAE
On the front, the 2U, 12 (3.5-inch) disk drive DAE carrier includes the following hardware
components:
◆
3.5-inch 6-Gb/s SAS or 6-Gb/s NL-SAS disk drives (hot-swappable)
6
◆
Status LEDs
shows the location of these components.
Figure 24 2U, 12 (3.5-inch) DAE (front view)
6. You can add or remove a disk drive while the DAE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.
1
3.5-inch SAS drives
1
1. The VNXe3100 platform also supports 6-Gb/s NL-SAS drives. For more information about the disk drives
supported in the VNXe3100, refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
3
Disk drive ready/activity LED (blue)
2
DAE power on LED (blue)
Installation
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
SAS 450 GB 15K RPM
1
2
3
VNX-000090