Dell E665, Owner'S Manual

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Table 22. Expansion card slots supported on the system board
PCIe slot Riser PCIe slot height PCIe slot length Slot width
Slot 1 LOM Riser
a
Unique to Dell Unique to Dell x8 (Gen 3)
Slot 2 Riser 1A Low-profile Half-length x16 (Gen 3)
Slot 3 Riser 2 Low-profile Half-length x16 (Gen 4)
a.
The LOM riser contains the OCP network card.
Memory specifications
The VxRail E665 Series appliance supports the following memory specifications for optimized operation.
Table 23. Memory specifications
DIMM type DIMM rank DIMM capacity Minimum RAM Maximum RAM
RDIMM Dual rank
16 GB 16 GB 256 GB
32 GB 32 GB 512 GB
64 GB 64 GB 1 TB
Table 24. Memory module sockets
Memory module sockets Speed
Sixteen 288-pin 3200 MT/s
a
a.
The clock speed operates at 2933 MT/s if greater than 10 DIMMs are populated.
Storage controller specifications
The VxRail E665 Series appliance supports the following controller cards:
● Internal controllers : PowerEdge Expandable RAID Controller (PERC) HBA330
NOTE: There is no internal storage controller for the VxRail E665N (NVMe) configuration.
● Boot Optimized Storage Subsystem (BOSS-S1) : HWRAID 2x M.2 SSDs
● Onboard controller : Software RAID (SWRAID) S140
Drives
The VxRail E665 Series appliance supports the following configurations:
●
Hybrid : Up to 8 x 2.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 7
○ Configured as one or two disk groups: 1 cache drive (SAS) + up to 3 capacity drives (HDD) per group
● All Flash : Up to 8 x 2.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 7
○ Configured as one or two disk groups: 1 cache drive (SAS) + up to 3 capacity drives (SAS/SATA) per group
● All NVMe : Up to 10 x 2.5-inch front accessible NVMe drives in slot 0 to 9
○ Configured as one or two disk groups: 1 cache drive (NVMe) + up to 4 capacity drives (NVMe) per group
NOTE: The front accessible NVMe drives currently utilize PCIe Gen3.
NOTE: Refer to the VxRail Series procedures in SolVe Online or the SolVe Desktop application before performing any
hardware replacement or upgrade activity.
Technical specifications 23