Contents
1 Product overview.............................................................................................................5
Introduction
........................................................................................................................................................................ 5
New technologies
...............................................................................................................................................................5
2 Product features............................................................................................................. 6
Product specifications
........................................................................................................................................................ 6
3 Chassis views and features............................................................................................. 8
Front view of the system
....................................................................................................................................................8
Rear view of the system
.....................................................................................................................................................8
Inside the system
.............................................................................................................................................................. 10
4 Processor...................................................................................................................... 13
Processor features
............................................................................................................................................................ 13
Supported processors
....................................................................................................................................................... 13
Chipset
..............................................................................................................................................................................13
5 Memory......................................................................................................................... 15
Supported memory
........................................................................................................................................................... 15
Memory speed
..................................................................................................................................................................15
Memory configurations
..................................................................................................................................................... 15
Memory RAS features
.......................................................................................................................................................16
6 Storage.......................................................................................................................... 17
Drives
................................................................................................................................................................................17
Storage controller specifications
....................................................................................................................................... 18
Internal Dual SD Module (IDSDM)
.....................................................................................................................................18
Boot Optimized Storage Subsystem (BOSS)
.............................................................................................................. 18
7 External storage.............................................................................................................19
Optical drive
......................................................................................................................................................................19
Tape drive
......................................................................................................................................................................... 19
8 Networking and PCIe.................................................................................................... 20
9 Power, thermal, and acoustics....................................................................................... 21
Power supply units
............................................................................................................................................................ 21
Power supply efficiency
...............................................................................................................................................21
Thermal
............................................................................................................................................................................ 22
Thermal design
...........................................................................................................................................................22
Acoustical design
..............................................................................................................................................................22
10 Supported operating systems...................................................................................... 23
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