2
System features
Product comparison
The following table shows the comparison between the PowerEdge MX740c (designed for PowerEdge MX7000 chassis) and
PowerEdge M640/FC640 (designed for PowerEdge M1000e/VRTX and FX2/FX2S chassis) modular server:
Table 2. Comparison table
Feature
PowerEdge MX740c
PowerEdge M640/FC640
Processor
•
One or two Intel® Xeon Scalable Processors
•
Up to 28 cores per socket
•
Max TDP: 205W
•
One or two Intel® Xeon Scalable Processors
•
Up to 28 cores per socket
•
Max TDP: 165 W
Chipset
•
Intel® C628
•
Optional Intel® QuickAssist Technology (QAT)
•
Intel® C621
Memory
•
24 DIMM slots
•
12 slots enabled for NVDIMM-N
•
Maximum capacity (RDIMM): 768GB
•
Maximum capacity (LRDIMM): 3TB
•
Maximum capacity (NVDIMM-N): 192GB
•
16 DIMM sockets
•
Maximum capacity (RDIMM): 512GB
•
Maximum capacity (LRDIMM): 2TB
Storage Controllers
•
S140 Software RAID
•
HBA330 MX
•
H730P MX Performance RAID, 2GB NV cache
•
H745P MX Performance RAID, internal and
external drive connect, 8GB NV cache
•
HBA330 MX mini-mezz, HBA, external drive
connect, no cache
•
S140 Software RAID
•
H330 Entry/Value RAID, no cache
•
H730P Performance RAID, 2GB NV cache
Drive Support
•
2.5-inch 12Gb SAS
•
2.5-inch 6Gb SATA
•
2.5-inch NVMe
•
2.5-inch 12Gb SAS
•
2.5-inch 6Gb SATA
•
2.5-inch NVMe
Drive Backplanes
•
6 x 2.5-inch SAS/SATA
•
6 x 2.5-inch SAS/SATA/NVMe
•
4 x 2.5-inch SAS/SATA/NVMe for NVDIMM
implementations
•
2 x 2.5-inch SAS/SATA/NVMe
Internal Boot
Choice of BOSS (Boot Optimized Storage
Subsystem) or IDSDM (Internal Dual SD Module)
Choice of BOSS (Boot Optimized Storage
Subsystem) or IDSDM (Internal Dual SD Module)
I/O Slots
•
Two PCIe 3.0 x16 Mezz slots (Fabric A and B)
•
One PCIe 3.0 x16 Mini-mezz slot (Fabric C)
•
One bNDC (Ethernet)
•
Two PCIe 3.0 x8 Mezz slots (M1000e)
•
Two PCIe 2.0 x8 switch mezz (VRTX)
•
PCIe adapter for FX2S enablement (FX2)
USB
•
One internal USB 3.0 port
•
One external USB 3.0 port
•
One internal USB 3.0 port
•
One external USB 3.0 port
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