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72-Mbit QDR™-II SRAM 4-Word

Burst Architecture

CY7C1511V18, CY7C1526V18

CY7C1513V18, CY7C1515V18

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document Number: 38-05363 Rev. *F

 Revised August 06, 2008

Features

Separate independent read and write data ports

Supports concurrent transactions

300 MHz clock for high bandwidth

4-word burst for reducing address bus frequency 

Double Data Rate (DDR) interfaces on both read and write ports 
(data transferred at 600 MHz) at 300 MHz 

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock 
skew and flight time mismatches 

Echo clocks (CQ and CQ) simplify data capture in high-speed 
systems

Single multiplexed address input bus latches address inputs 
for read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core V

DD 

= 1.8 (± 0.1V); IO V

DDQ

 = 1.4V to V

DD

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Configurations

CY7C1511V18 – 8M x 8

CY7C1526V18 – 8M x 9

CY7C1513V18 – 4M x 18

CY7C1515V18 – 2M x 36

Functional Description

The CY7C1511V18, CY7C1526V18, CY7C1513V18, and
CY7C1515V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II archi-
tecture has separate data inputs and data outputs to completely
eliminate the need to “turn-around” the data bus that exists with
common IO devices. Each port can be accessed through a
common address bus. Addresses for read and write addresses
are latched on alternate rising edges of the input (K) clock.
Accesses to the QDR-II read and write ports are completely
independent of one another. To maximize data throughput, both
read and write ports are equipped with DDR interfaces. Each
address location is associated with four 8-bit words
(CY7C1511V18), 9-bit words (CY7C1526V18), 18-bit words
(CY7C1513V18), or 36-bit words (CY7C1515V18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K and C and C), memory bandwidth is maximized
while simplifying system design by eliminating bus
“turn-arounds”.

Depth expansion is accomplished with port selects, which
enables each port to operate independently.

All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.

Selection Guide

Description

300 MHz

278 MHz

250 MHz

200 MHz

167 MHz

Unit

Maximum Operating Frequency 

300

278

250

200

167

MHz

Maximum Operating Current 

x8

930

865

790

655

570

mA

x9

940

870

795

660

575

x18

1020

950

865

715

615

x36

1230

1140

1040

850

725

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Summary of Contents for CY7C1511V18

Page 1: ...rts the read port and the write port to access the memory array The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operat...

Page 2: ...eg Reg Reg 16 21 32 8 NWS 1 0 VREF Write Add Decode Write Reg 16 A 20 0 21 8 CQ CQ DOFF Q 7 0 8 8 8 Write Reg Write Reg Write Reg C C 2M x 8 Array 2M x 8 Array 2M x 8 Array 8 CLK A 20 0 Gen K K Contro...

Page 3: ...VREF Write Add Decode Write Reg 36 A 19 0 20 18 CQ CQ DOFF Q 17 0 18 18 18 Write Reg Write Reg Write Reg C C 1M x 18 Array 1M x 18 Array 1M x 18 Array 1M x 18 Array 18 512K x 36 Array CLK A 18 0 Gen...

Page 4: ...VDDQ VSS VSS VSS VDDQ NC NC Q0 M NC NC NC VSS VSS VSS VSS VSS NC NC D0 N NC D7 NC VSS A A A VSS NC NC NC P NC NC Q7 A A C A A NC NC NC R TDO TCK A A A C A A A TMS TDI CY7C1526V18 8M x 9 1 2 3 4 5 6 7...

Page 5: ...A NC D0 Q0 R TDO TCK A A A C A A A TMS TDI CY7C1515V18 2M x 36 1 2 3 4 5 6 7 8 9 10 11 A CQ VSS 288M A WPS BWS2 K BWS1 RPS A VSS 144M CQ B Q27 Q18 D18 A BWS3 K BWS0 A D17 Q17 Q8 C D27 Q28 D19 VSS A N...

Page 6: ...7C1511V18 8M x 9 4 arrays each of 2M x 9 for CY7C1526V18 4M x 18 4 arrays each of 1M x 18 for CY7C1513V18 and 2M x 36 4 arrays each of 512K x 36 for CY7C1515V18 Therefore only 21 address inputs are ne...

Page 7: ...connected between ZQ and ground Alternatively this pin can be connected directly to VDDQ which enables the minimum impedance mode This pin cannot be connected directly to GND or left unconnected DOFF...

Page 8: ...l logic of the device ignores the second read request Read accesses can be initiated on every other K clock rise Doing so pipelines the data flow such that data is transferred out of the device on eve...

Page 9: ...input can deselect the specified port Deselecting a port does not affect the other port All pending transactions read and write are completed before the device is deselected Programmable Impedance An...

Page 10: ...S ZQ CQ CQ Q K BUS MASTER CPU or ASIC DATA IN DATA OUT Address RPS WPS BWS Source K Source K Delayed K Delayed K CLKIN CLKIN Notes 2 X Don t Care H Logic HIGH L Logic LOW represents rising edge 3 Devi...

Page 11: ...nly the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY7C1513V18 only the upper byte D 17 9 is written into the device D 8 0 remains unaltered H L L H During the data portion...

Page 12: ...nly the byte D 17 9 is written into the device D 8 0 and D 35 18 remains unaltered H L H H L H During the Data portion of a write sequence only the byte D 17 9 is written into the device D 8 0 and D 3...

Page 13: ...g edge of TCK Instruction Register Three bit instructions can be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Co...

Page 14: ...y scan register After the data is captured it is possible to shift out the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD p...

Page 15: ...roller follows 11 TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR 1 0 1 1 0 1 0 1 0 0 0 1 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 0 0 1 1 0 SELECT IR SCA...

Page 16: ...IGH Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 108 0 1 2 Inst...

Page 17: ...DIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions Fig...

Page 18: ...uction Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO Th...

Page 19: ...8P 35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15...

Page 20: ...k K K for 1024 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL functions at frequencies do...

Page 21: ...HIGH Voltage Note 18 VDDQ 2 0 12 VDDQ 2 0 12 V VOL Output LOW Voltage Note 19 VDDQ 2 0 12 VDDQ 2 0 12 V VOH LOW Output HIGH Voltage IOH 0 1 mA Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Vol...

Page 22: ...ic 300MHz x8 400 mA x9 400 x18 400 x36 400 278MHz x8 390 mA x9 390 x18 390 x36 390 250MHz x8 380 mA x9 380 x18 380 x36 380 200MHz x8 360 mA x9 360 x18 360 x36 360 167MHz x8 340 mA x9 340 x18 340 x36 3...

Page 23: ...unction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 16 3 C W JC Thermal Resistance Junction to Case 2 1 C W Fig...

Page 24: ...RPS WPS 0 4 0 4 0 5 0 6 0 7 ns tSCDDR tIVKH Double Data Rate Control Setup to Clock K K Rise BWS0 BWS1 BWS2 BWS3 0 3 0 3 0 35 0 4 0 5 ns tSD 25 tDVKH D X 0 Setup to Clock K K Rise 0 3 0 3 0 35 0 4 0...

Page 25: ...Clock C C Rise to High Z Active to High Z 26 27 0 45 0 45 0 45 0 45 0 50 ns tCLZ tCHQX1 Clock C C Rise to Low Z 26 27 0 45 0 45 0 45 0 45 0 50 ns DLL Timing tKC Var tKC Var Clock Phase Jitter 0 20 0 2...

Page 26: ...D tCLZ DOH tCHZ t t tKL tCYC tCCQO t CCQO tCQOH tCQOH KHKH KH Q00 Q03 Q01 Q02 Q20 Q23 Q21 Q22 tCO tCQDOH t D10 D11 D12 D13 t SD tHD tSD tHD D30 D31 D32 D33 Notes 28 Q00 refers to output from address A...

Page 27: ...65 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1526V18 300BZI CY7C1513V18 300BZI CY7C1515V18 300BZI CY7C1511V18 300BZXI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 m...

Page 28: ...250BZXI 200 CY7C1511V18 200BZC 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Commercial CY7C1526V18 200BZC CY7C1513V18 200BZC CY7C1515V18 200BZC CY7C1511V18 200BZXC 51 85195 165 Ball...

Page 29: ...18 167BZXC CY7C1511V18 167BZI 51 85195 165 Ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1526V18 167BZI CY7C1513V18 167BZI CY7C1515V18 167BZI CY7C1511V18 167BZXI 51 85195 165 Ball Fi...

Page 30: ...3V18 CY7C1515V18 Document Number 38 05363 Rev F Page 30 of 32 Package Diagram Figure 6 165 ball FBGA 15 x 17 x 1 4 mm 51 85195 0 2 2 8 8 8 3 4 0 0 2 2 4 0 6 7 44 6 7 0 2 0 2 3 2 0 490 3 2 3 3 4 3 0 7...

Page 31: ...nal Added CY7C1526V18 part number to the title Added 278 MHz speed Bin Changed address of Cypress Semiconductor Corporation on Page 1 from 3901 North First Street to 198 Champion Court Changed C C Pin...

Page 32: ...above is prohibited without the express written permission of Cypress Disclaimer CYPRESS MAKES NO WARRANTY OF ANY KIND EXPRESS OR IMPLIED WITH REGARD TO THIS MATERIAL INCLUDING BUT NOT LIMITED TO THE...

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