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CY62148E MoBL

®

Document #: 38-05442 Rev. *F

Page 3 of 10

Maximum Ratings

Exceeding maximum ratings may impair the useful life of the

device. These user guidelines are not tested.
Storage Temperature  ................................ –65°C to + 150°C
Ambient Temperature with

Power Applied............................................ –55°C to + 125°C
Supply Voltage to Ground

Potential.................................–0.5V to 6.0V (V

CCmax 

+ 0.5V)

DC Voltage Applied to Outputs

in High-Z State 

[5, 6]

................–0.5V to 6.0V (V

CCmax 

+ 0.5V)

DC Input Voltage 

[5, 6]

............ –0.5V to 6.0V (V

CCmax 

+ 0.5V)

Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage........................................... > 2001V

(per MIL-STD-883, Method 3015)
Latch-up Current ......................................................>200mA

Operating Range

Device

Range

Ambient 

Temperature

V

CC 

[7]

CY62148E

Ind’l/Auto-A

–40°C to +85°C 

4.5V to 5.5V

Electrical Characteristics 

(Over the Operating Range)

Parameter

Description

Test Conditions

45 ns 

55 ns 

[2]

Unit

Min Typ 

[3]

Max

Min Typ 

[3]

Max

V

OH

Output HIGH 

Voltage

I

OH

 = –1 mA

2.4

2.4

V

V

OL

Output LOW Voltage I

OL

 = 2.1 mA

0.4

0.4

V

V

IH

Input HIGH Voltage V

CC 

= 4.5V to 5.5V

2.2

V

CC 

+ 0.5 2.2

V

CC 

+ 0.5

V

V

IL

Input LOW voltage

V

CC 

= 4.5V to 5.5V For TSOPII 

package

–0.5

0.8

V

For SOIC 

package

–0.5

0.6 

[8]

I

IX

Input Leakage 

Current

GND < V

I

 < V

CC

–1

+1

–1

+1

µ

A

I

OZ

Output Leakage 

Current

GND < V

< V

CC

, Output Disabled

–1

+1

–1

+1

µ

A

I

CC

V

CC

 Operating 

Supply Current 

f = f

max

 = 1/t

RC

V

CC

 = V

CC(max)

I

OUT

 = 0 mA

CMOS levels

15

20

15

20

mA

f = 1 MHz

2

2.5

2

2.5

I

SB2 

[9]

Automatic CE Power 

down Current — 

CMOS Inputs

CE > V

CC

 – 0.2V 

V

IN

 > V

CC

 – 0.2V or V

IN 

< 0.2V,

f = 0, V

CC

 = V

CC(max)

1

7

1

7

µ

A

Capacitance

 (For All Packages) 

[10]

Parameter

Description

Test Conditions

Max

Unit

C

IN

Input Capacitance

T

A

 = 25°C, f = 1 MHz,

V

CC

 = V

CC(typ)

10

pF

C

OUT

Output Capacitance

10

pF

Notes

5. V

IL(min)

 = –2.0V for pulse durations less than 20 ns for I < 30 mA.

6. V

IH(max) 

= V

CC

+0.75V for pulse durations less than 20 ns.

7. Full device AC operation assumes a minimum of 100 µs ramp time from 0 to V

CC

(min) and 200 µs wait time after V

CC 

stabilization.

8. Under DC conditions the device meets a V

IL

 of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.6V. This 

is applicable to SOIC package only. Refer to AN13470 for details.

9. Only chip enable (CE) must be HIGH at CMOS level to meet the I

SB2

 spec. Other inputs can be left floating.

10. Tested initially and after any design or process changes that may affect these parameters.

[+] Feedback 

Summary of Contents for CY62148E

Page 1: ...educes power consumption by more than 99 when deselected CE HIGH The eight input and output pins IO0 through IO7 are placed in a high impedance state when Deselected CE HIGH Outputs are disabled OE HIGH Write operation is active CE LOW and WE LOW To write to the device take Chip Enable CE and Write Enable WE inputs LOW Data on the eight IO pins IO0 through IO7 is then written into the location spe...

Page 2: ...A 13 A 14 A 15 A 16 A 17 ROW DECODER COLUMN DECODER 512K x 8 ARRAY INPUT BUFFER A10 A11 A12 A 18 Note 4 NC pins are not connected on the die 1 2 3 4 5 6 7 8 9 10 11 14 31 32 12 13 16 15 29 30 21 22 19 20 27 28 25 26 17 18 23 24 32 pin SOIC TSOP II Pinout Top View A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 VSS VCC A18 WE OE CE Feedback ...

Page 3: ...8 V For SOIC package 0 5 0 6 8 IIX Input Leakage Current GND VI VCC 1 1 1 1 µA IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 1 1 µA ICC VCC Operating Supply Current f fmax 1 tRC VCC VCC max IOUT 0 mA CMOS levels 15 20 15 20 mA f 1 MHz 2 2 5 2 2 5 ISB2 9 AutomaticCEPower down Current CMOS Inputs CE VCC 0 2V VIN VCC 0 2V or VIN 0 2V f 0 VCC VCC max 1 7 1 7 µA Capacitance For All Packages...

Page 4: ...perating Range Parameter Description Conditions Min Typ 3 Max Unit VDR VCC for Data Retention 2 V ICCDR Data Retention Current VCC VDR CE VCC 0 2V VIN VCC 0 2V or VIN 0 2V Ind l Auto A 1 7 µA tCDR 10 Chip Deselect to Data Retention Time 0 ns tR 11 Operation Recovery Time tRC ns Data Retention Waveform 3 0V VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90 10 90 10 Rise Time 1 V ns Fall Time 1 V n...

Page 5: ...s tSD Data Setup to Write End 25 25 ns tHD Data Hold from Write End 0 0 ns tHZWE WE LOW to High Z 13 14 18 20 ns tLZWE WE HIGH to Low Z 13 10 10 ns Notes 12 Test conditions for all parameters other than tri state parameters assume signal transition time of 3 ns or less timing reference levels of 1 5V input pulse levels of 0 to 3V and output loading of the specified IOL IOH as shown in the AC Test ...

Page 6: ...MPEDANCE tHZOE tHZCE tPD IMPEDANCE ICC ISB HIGH ADDRESS CE DATA OUT VCC SUPPLY CURRENT OE DATA VALID tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE ADDRESS CE WE DATA IO OE NOTE 21 Notes 16 Device is continuously selected OE CE VIL 17 WE is HIGH for read cycles 18 Address valid before or similar to CE transition LOW 19 Data IO is high impedance if OE VIH 20 If CE goes HIGH simultaneously with WE HIGH the...

Page 7: ...de Power H X X High Z Deselect Power down Standby ISB L H L Data Out Read Active ICC L L X Data In Write Active ICC L H H High Z Selected Outputs Disabled Active ICC Switching Waveforms continued tWC DATA VALID tAW tSA tPWE tHA tHD tSD tSCE ADDRESS CE DATA IO WE DATA VALID tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE ADDRESS CE WE DATA IO NOTE 21 Feedback ...

Page 8: ...n Thin Small Outline Package II Pb free Industrial 55 CY62148ELL 55SXI 51 85081 32 pin Small Outline Integrated Circuit Pb free Industrial 55 CY62148ELL 55SXA 51 85081 32 pin Small Outline Integrated Circuit Pb free Automotive A Contact your local Cypress sales representative for availability of these parts Package Diagrams Figure 1 32 pin TSOP II 51 85095 51 85095 Feedback ...

Page 9: ...t systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges Figure 2 32 pin 450 MIL Molded SOIC 51 85081 MoBL is a registered trademark and More Battery Life is a ...

Page 10: ...ion Court Removed 35ns Speed Bin Removed L version of CY62148E Changed ICC Typ value from 1 5 mA to 2 mA at f 1 MHz Changed ICC Max value from 2 mA to 2 5 mA at f 1 MHz Changed ICC Typ value from 12 mA to 15 mA at f fmax Removed ISB1 spec from the Electrical characteristics table Changed ISB2 Typ values from 0 7 µA to 1 µA and Max values from 2 5 µA to 7 µA Modified footnote 4 to include current l...

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