Copyright © 2008-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are registered trademarks and the Cree logo is a trademark of
Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor
endorsement, sponsorship or association.
3
XLamp
®
XR FamiLy LED SoLDERing & HanDLing
CiRCuiT boaRD pREpaRaTion & LayouTs
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp XR family LEDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp XR family LEDs.
CasE TEmpERaTuRE (T
s
) mEasuREmEnT poinT
XLamp XR family LED case temperature (T
s
) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the pictures below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XR family LED itself. In testing, Cree has found
such a solder pad to have insignificant impact on the resulting Ts measurement.
7.0 mm
5.6 mm
0.70 mm
8.4 mm
6.46 mm
Recommended PC Board Solder Pad
Recommended solder pad
for XLamp XR family LEDs
6.36
8.30
0.60
0.80
0.80
0.60
5.50
7.10
RECOMMENDED STENCIL PATTERN 7090
(HATCHED AREA IS OPENING)
Recommended stencil pattern
for XLamp XR family LEDs
(hatched area is opening)
