Copyright © 2013-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
6
XLamp
®
mT FamiLy & mK FamiLy LED SoLDEring & HanDLing
noTEs on soLDErIng XLaMp
®
MT FaMILy anD MK FaMILy LEDs
XLamp MT Family and MK Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page.
Do not wave solder XLamp MT Family or MK Family LeDs. Do not hand solder XLamp MT Family or MK Family LeDs.
solder paste Type
Cree strongly recommends using “no clean” solder paste with XLamp MT Family or MK Family LEDs so that cleaning the PCB after reflow
soldering is not required. Cree uses
internally.
Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
solder paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.
P
CorrECT
P
CorrECT
X
Wrong
P
CorrECT
X
Wrong
