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CPWR-AN26, Rev A, 08-2018
Copyright © 2018 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree and Zero Recovery are registered trademarks, and the Cree logo and C3M are trademarks, of Cree, Inc
The thermal
data of Cree’s
CRD-06600FF10N reference design board is taken at full load. Figure
11 indicates the thermal data of Inductor L1, Inductor L2, PFC Boost Inductor and Transformer.
Figure 11. Thermal Measurements of various components
As illustrated by the images above, the boost inductor can reach extremely high temperatures,
particularly if the board is tested under full load for an extended period of time. A user should
direct air flow over the top side of the control board in order to reduce the temperature of the
boost inductor. The failure to use air flow in this manner to manage the temperature of the boost
inductor could result in a reduction in performance of or damage to the board.