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8
3.
Application Guide
A.
Basic ESD Control
It is mandatory requirements such as personal grounding,
ESD safe worksurfaces and use ESD safe packaging
material for all electronics industry. These are well known
and easy to establish in ESD protected area (EPA) compare
with following issues.
B.
Ionization for CDM/CBE Controls
Every device has their own ESD sensitivities and they can
damage by beyond this sensitivity limits. According to
many IC manufacturing suppliers, over 99% of device ESD
failures are CDM or CDM like and not HBM or very low
possibility. Due to automation and device sensitivity
continue to be lowering, vulnerability of device CDM are
increasing. Not only CDM, but also Charge Board Event
like ESD issues are increasing due to their complexity and
large amount of charge stored on printed circuit board.
There are two strategical guidance has proposed by ESD
Association. Lowering device charge level and increase
resistance of contact materials are the key strategical
elements to prevent ESD damage. As per ANSI/ESD
S20.20-2014 latest version described, maximum allowing
