HE-B72 User’s Manual
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1.2 <Product Specification>
System
Processor
Intel® Skylake Core™ i7, i5, i3 H-seriesProcessor, FCLGA1440 package
Chipset
Intel® QM170 PCH-H
Memory
2 x DDR4 SO-DIMM 2133 MHz up to 32GB,
Support Non-ECC, unbuffered memory only
Watchdog Timer
Generates a system reset with internal timer for 1min/s ~ 255min/s
Real Time Clock
Chipset integrated RTC with onboard lithium battery
Expansion
1 x MiniPCIe
(support mSATA)
1 x Half-Size MiniPCIe
1 x PCIe X16 slot,
1 x PCIe X4 or 4 x PCIe X1 slot
(optional)
1 x Sim slot
Graphics
Chipset
Intel® 9th Gen integrated HD Graphics
Display Interface
2 x DVI-D, 1 x DisplayPort, 1 x LVDS, 1 x VGA
LAN
Chip
1 x Intel® I219-LM Gigabit PHY LAN
(Support iAMT11.0)
1 x Intel® I210-AT Gigabit LAN
I/O
Serial ATA
3 x SATA3
Audio
Realtek ALC262 HD Audio
Internal I/O
3 x SATA3, 5 x RS232, 4 x USB2.0, 4 x USB3.0, 1 x LVDS, 1 x LPC
1 x LCD inverter, 1 x GPIO , 1 x Audio, 1 x SMBUS, 1 x VGA, 2 x DVI-D
1 x RS232/422/485
Rear I/O
1 x DisplayPort
,
2 x LAN, 1 x PS/2
Mechanical & Environmental
Power Requirement
Standard 24-pin ATX power from Backplane
Size & Thickness
168mm x 126mm (L x W)
Temperature
Operating within 0°C~60°C (32°F~140°F)
Storage within -20°C~80°C (-4°F~176°F)
Relative Humidity
10%~90%, non-condensing