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CMT2300A

4.3.8 Clock Data Recovery (CDR)

The basic task of a CDR system is to recover the clock signal that is synchronized with the symbol rate, while receiving the data. Not

only for decoding inside the chip, but also for outputting the synchronized clock to GPIO for users to sample the data. So CDR's

task is simple and important. If the recovered clock frequency is in error with the actual symbol rate, it will cause data acquisition

errors at the time of reception.

CMT2300A has designed three types of CDR systems, as follows:

COUNTING system

–The system is designed for the symbol rates to be more accurate. If the symbol rate is 100% aligned,

the unlimited length of 0 can be received continuously without error.

TRACING system

–The system is designed to correct the symbol rate error. It has the tracking function. It can automatically

detect the symbol rate transmitted by TX, and adjust quickly the local symbol rate of RX at the same time, so as to minimize

the error between them. The system can withstand up to 15.6% or symbol rate error. Other similar products in the industry

cannot reach this level.

MANCHESTER system

–This system evolves from the COUNTING system. The basic feature is the same. The only

difference is that the system is specially designed for Manchester codec. Special processing can be done when the TX

symbol rate has unexpected changes.

4.3.9 Fast Frequency Hopping

The mechanism of fast frequency hopping is, based on the frequency configured on the RFPDFK, for instance 433.92 MHz,

during

applications the MCU can simply change 1 or 2 registers to quickly switch to another frequency channel. This simplify the

way of change the RX or TX frequency in multiple channels application.

In general, the user can configure FH_OFFSET<7:0>during the chip initialization process. And then in the application, the user

can switch the channel by changing FH_CHANNEL<7:0>.

When users need to use the fast frequency hopping in the RX mode, in some particular frequency points, one parameter of the

AFC circuit must be re-configured. Please refer to

“AN197-CMT2300A-CMT2119B-CMT2219B fast frequency hopping” and

“CMT2300A-CMT2219B frequency hopping calculation tool” for more details.

Summary of Contents for CMT2300A-EQR

Page 1: ...e system design Up to 20 dBmTx Power and 121 dBm sensitivity optimize the performance of the application It supports a variety of packet formats and codec methods to meet the needs of various different applications In addition CMT2300A also supports 64 byte Tx Rx FIFO GPIO and interrupt configuration Duty Cycle operation mode channel sensing high precision RSSI low voltage detection power on reset...

Page 2: ...2 1 12 4 Sensitivity VS Temperature 13 1 12 5 Tx Power VS Supply Voltage 14 1 12 6 Tx Phase Noise 14 2 Pin Descriptions 16 3 Typical Application Schematic 18 3 1 Direct Tie Schematic Diagram 18 3 2 RF Switch Type Schematic 20 4 Function Descriptions 23 4 1 Transmitter 24 4 2 Receiver 24 4 3 Additional Functions 24 4 3 1 Power On Reset POR 24 4 3 2 Crystal Oscillator 25 4 3 3 Sleep Timer 26 4 3 4 L...

Page 3: ...PIO and Interrupt 36 6 Packet Handler 39 6 1 Direct Mode 39 6 2 Packet Mode 40 7 Low Power Operation 42 7 1 Duty Cycle Operation Mode 42 7 2 Super low Power Rx Mode 42 7 3 Receiver Power VS Performance Configuration 43 8 User Register 44 9 Ordering Information 46 10 Packaging Information 47 11 Top Marking 48 12 Revise History 49 13 Contacts 50 ...

Page 4: ...V Interface Voltage VIN 0 3 VDD 0 3 V Junction Temperature TJ 40 125 Storage Temperature TSTG 50 150 Soldering Temperature TSDR Lasts at least 30 seconds 255 ESD Rating 2 Human Body Model HBM 2 2 kV Latch up Current 85 100 100 mA Notes 1 Exceeding the Absolute Maximum Ratings may cause permanent damage to the equipment This value is a pressure rating and does not imply that the function of the equ...

Page 5: ...K 915 MHz 10 kbps 10 kHz FDEV 8 9 mA RX current low power mode IRx LP FSK 433 MHz 10 kbps 10 kHz FDEV 7 2 mA FSK 868 MHz 10 kbps 10 kHz FDEV 7 3 mA FSK 915 MHz 10 kbps 10 kHz FDEV 7 6 mA TX current ITx FSK 433 MHz 20 dBm Direct Tie 72 mA FSK 433 MHz 20 dBm RF switch 77 mA FSK 433 MHz 13 dBm Direct Tie 23 mA FSK 433 MHz 10 dBm Direct Tie 18 mA FSK 433 MHz 10 dBm Direct Tie 8 mA FSK 868 MHz 20 dBm D...

Page 6: ...m DR 20 kbps FDEV 20 kHz Low power setting 109 dBm DR 50 kbps FDEV 25 kHz 108 dBm DR 100 kbps FDEV 50 kHz 105 dBm DR 200 kbps FDEV 100 kHz 102 dBm DR 300 kbps FDEV 100 kHz 99 dBm Sensitivity 915 MHz S915 HP DR 2 0 kbps FDEV 10 kHz 117 dBm DR 10 kbps FDEV 10 kHz 113 dBm DR 10 kbps FDEV 10 kHz Low power mode 111 dBm DR 20 kbps FDEV 20 kHz 111 dBm DR 20 kbps FDEV 20 kHz Low power mode 109 dBm DR 50 k...

Page 7: ...IRange RSSI 120 20 dBm More Sensitivity Typical Configuration 433 92 MHz DR 1 2kbps FDEV 5 kHz 122 9 dBm 433 92 MHz DR 1 2kbps FDEV 10 kHz 121 8 dBm 433 92 MHz DR 1 2kbps FDEV 20 kHz 119 5 dBm 433 92 MHz DR 2 4kbps FDEV 5 kHz 120 6 dBm 433 92 MHz DR 2 4kbps FDEV 10 kHz 120 3 dBm 433 92 MHz DR 2 4kbps FDEV 20 kHz 119 7 dBm 433 92 MHz DR 9 6 kbps FDEV 9 6 kHz 116 0 dBm 433 92 MHz DR 9 6 kbps FDEV 19...

Page 8: ... Harmonic output for FRF 433 MHz 1 H2433 2nd harmonic 13 dBm POUT 52 dBm H3433 3nd harmonic 13 dBm POUT 52 dBm Harmonic output for FRF 868 MHz 1 H2868 2nd harmonic 13 dBm POUT 52 dBm H3868 3nd harmonic 13 dBm POUT 52 dBm Harmonic output for FRF 915 MHz 1 H2868 2nd harmonic 13 dBm POUT 52 dBm H3868 3nd harmonic 13 dBm POUT 52 dBm Notes 1 The harmonic parameter values mainly depend on the quality of...

Page 9: ... Hz 100 kHz frequency deviation 99 dBc Hz 500 kHz frequency deviation 118 dBc Hz 1MHz frequency deviation 127 dBc Hz 10 MHz frequency deviation 134 dBc Hz Phase noise 868 MHz PN868 10 kHz frequency deviation 92 dBc Hz 100 kHz frequency deviation 95 dBc Hz 500 kHz frequency deviation 114 dBc Hz 1MHz frequency deviation 121 dBc Hz 10 MHz frequency deviation 130 dBc Hz Phase noise 915 MHz PN915 10 kH...

Page 10: ...stal frequency tolerance is limited by the receiver bandwidth and the RF frequency offset between the transmitter and the receiver 3 The parameter is largely related to the crystal 1 9 Low Frequency Oscillator Table 9 Low Frequency Oscillator Specifications Parameter Symbol Condition Min Typ Max Unit Calibration frequency 1 FLPOSC 32 kHz Frequency accuracy After calibration 1 Temperature coefficie...

Page 11: ...VIL 0 2 VDD Digital output high level VOH IOH 0 5mA Vdd 0 4 V Digital output low level VOL IOL 0 5mA 0 4 V SCLK Frequency FSCL 5 MHz SCLK high time TCH 50 ns SCLK low time TCL 50 ns SCLKrise time TCR 50 ns SCLKfall time TCF 50 ns 1 12Figures of Critical Parameters 1 12 1 Rx Current VS Supply Voltage Testing Condition Freq 434MHz 868MHz Fdev 10KHz BR 10Kbps 7 40 7 60 7 80 8 00 8 20 8 40 8 60 8 80 3...

Page 12: ...est Condition Freq 868MHz Fdev 10KHz BR 10Kbps 1 12 3 Sensitivity VS Voltage 7 0 7 3 7 5 7 8 8 0 8 3 8 5 8 8 9 0 9 3 9 5 40 25 85 Current Consumption mA Temperature Rx Current vs Volt Temp 3 3V 1 8V 3 6V 7 0 7 3 7 5 7 8 8 0 8 3 8 5 8 8 9 0 9 3 9 5 40 25 85 Current Consumption mA Temperature Rx Current vs Volt Temp 3 3V 1 8V 3 6V ...

Page 13: ...ure Test Condition FSK DEV 10KHz BR 10Kbps 117 5 117 0 116 5 116 0 115 5 115 0 114 5 114 0 113 5 113 0 1 8 2 1 2 4 2 8 3 0 3 3 3 6 Sensitivity dBm Supply Voltage V Sensitivity vs Voltage 434MHz 868MHz 118 0 117 0 116 0 115 0 114 0 113 0 112 0 40 25 85 Sensitivity dBm Temperature Sensitivity vs Temperature 434MHz 868MHz ...

Page 14: ... 10 0 11 0 12 0 13 0 14 0 15 0 16 0 17 0 18 0 19 0 20 0 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 2 2 1 2 0 1 9 1 8 Tx Power dBm Supply Voltage V Tx Power vs Supply Voltage 20dBm 13dBm 9 0 10 0 11 0 12 0 13 0 14 0 15 0 16 0 17 0 18 0 19 0 20 0 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 1 2 1 2 0 1 9 1 8 Tx Power dBm Supply Voltage V Tx Power vs Supply Voltage...

Page 15: ...42 434 92 435 42 435 92 Power dBm center 433 92MHz sweep 5s 2000pts Res BW 1kHz 433 92MHz Phase Noise output 13dBm span 4MHz att30dB 12 4dBm 100 80 60 40 20 0 20 866 866 5 867 867 5 868 868 5 869 869 5 870 Power dBm center 868MHz sweep 5s 2000pts Res BW 1kHz 868MHz Phase Noise output 13dBm span 4MHz att30dB ...

Page 16: ...2300APin Descriptions Pin Name I O Internal IO Schematic Descriptions 1 RFIP I RF signal input P 2 RFIN I RF signal input N 3 PA O PA output 4 AVDD IO Analog VDD 5 AGND IO Analog GND 6 DGND IO Digital GND 7 DVDD IO Digital VDD 8 1 GPIO3 IO GPIO3 din pd_din dout pd_dout Data tristate pd_din default value is 1 pd_dout default value is 0 VDD Configured as CLKO DOUT DIN INT2 and DCLK TX RX 9 SCLK I SC...

Page 17: ...t 14 XO O Crystal circuit output 15 1 GPIO2 IO GPIO2 din pd_din dout pd_dout Data tristate pd_din default value is 1 pd_dout default value is 0 VDD Configured as INT1 INT2 DOUT DIN DCLK TX RX and RF_SWT 16 1 GPIO1 IO GPIO1 din pd_din dout pd_dout Data tristate pd_din default value is 1 pd_dout default value is 0 VDD Configured as DOUT DIN INT1 INT2 DCLK TX RX and RF_SWT 17 GND I Analog GND It must...

Page 18: ... 2 2 2 pF C8 5 0603 NP0 50 V 4 7 uF C9 5 0603 NP0 50 V 470 pF C10 5 0603 NP0 50 V 0 1 uF C11 5 0603 NP0 50 V 0 1 uF L1 5 0603 Multilayer chip inductor 180 100 100 nH Sunlord SDCL L2 5 0603 Multilayer chip inductor 56 10 8 2 nH Sunlord SDCL L3 5 0603 Multilayer chip inductor 39 8 2 6 8 nH Sunlord SDCL L4 5 0603 Multilayer chip inductor 18 10 8 2 nH Sunlord SDCL L5 5 0603 Multilayer chip inductor 18...

Page 19: ... C10 5 0603 NP0 50 V 0 1 uF C11 5 0603 NP0 50 V 0 1 uF L1 5 0603 Multilayer chip inductor 180 100 100 nH Sunlord SDCL L2 5 0603 Multilayer chip inductor 22 12 12 nH Sunlord SDCL L3 5 0603 Multilayer chip inductor cap 15pF 15 15 nH Sunlord SDCL L4 5 0603 Multilayer chip inductor 33 6 2 6 2 nH Sunlord SDCL L5 5 0603 Multilayer chip inductor 33 6 2 6 2 nH Sunlord SDCL L6 5 0603 Multilayer chip induct...

Page 20: ...www cmostek com Rev1 0a 20 50 CMT2300A 3 2 RF Switch Type Schematic Figure 3 Application Schematic Diagram for RF Switch Type ...

Page 21: ... 24 24 pF C17 5 0402 NP0 50 V 10 10 pF C18 5 0402 NP0 50 V 10 10 pF C19 5 0402 NP0 50 V 27 pF C20 5 0402 NP0 50 V 27 pF C21 5 0402 NP0 50 V 27 pF C22 5 0402 NP0 50 V 27 pF L1 5 0603 Multilayer chip inductor 180 100 nH Sunlord SDCL L2 5 0402 Multilayer chip inductor 27 6 8 nH Sunlord SDCL L3 5 0402 Multilayer chip inductor 18 12 nH Sunlord SDCL L4 5 0402 Multilayer chip inductor 33 22 nH Sunlord SD...

Page 22: ...layer chip inductor 33 22 nH Sunlord SDCL L5 5 0402 Multilayer chip inductor 15 10 nH Sunlord SDCL L6 5 0402 Multilayer chip inductor 27 12 nH Sunlord SDCL L7 5 0402 Multilayer chip inductor 27 12 nH Sunlord SDCL L8 5 0402 Multilayer chip inductor 68 18 nH Sunlord SDCL Y1 10 ppm SMD32 25 mm 26 MHz EPSON U1 CMT2300A Ultra Low Power Sub 1GHz RF Transceiver CMOSTEK U2 AS179 PHEMT GaAs IC SPDT Switch ...

Page 23: ... circuit mixes the RF signal to IF and converts the signal from analog to digital through the Limiter module then outputs I Q two single bit signals to the digital circuit for G FSK demodulation At the same time SARADC will convert the real time RSSI signal to 8 bit digital signal and sent them to the digital part for OOK demodulation and other processing The digital circuit is responsible for mix...

Page 24: ... package elements 4 2 Receiver CMT2300A has a built in ultra low power high performance low IF OOK FSK receiver The RF signal induced by the antenna is amplified by a low noise amplifier and is converted to an intermediate frequency by an orthogonal mixer The signal is filtered by the image rejection filter and is amplified by the limiting amplifier and then sent to the digital domain for digital ...

Page 25: ...tion of POR 4 3 2Crystal Oscillator The crystal oscillator provides a reference clock for the phase locked loop as well as a system clock for the digital circuits The value of load capacitance depends on the crystal specified CL parameters The total load capacitance between XI and XO should be equal to CL in order to make the crystal accurately oscillate at 26 MHz C15 and C16 are the load capacita...

Page 26: ...rithmic amplifier of I channels and Q channel contains the received signal indicator in which the DC voltage is generated is proportional to the input signal strength The output of RSSI is the sum of the values of the two channels signals The output has 80dB dynamic range above the sensitivity After the RSSI output is sampled by the ADC and filtered by a SAR FILTER and a RSSI AVG FILTER The order ...

Page 27: ...1 otherwise outputs logic 0 The output can be used as a source of the RSSI VLD interrupt or the receive time extending condition in the super low power SLP mode In direct data mode by setting the DOUT_MUTE register bit to 1 the PJD can mute the FSK demodulated data output while there is not wanted signal received The PJD technique is similar to the traditional carrier sense technique but more reli...

Page 28: ...een them The system can withstand up to 15 6 or symbol rate error Other similar products in the industry cannot reach this level 3 MANCHESTER system This system evolves from the COUNTING system The basic feature is the same The only difference is that the system is specially designed for Manchester codec Special processing can be done when the TX symbol rate has unexpected changes 4 3 9 Fast Frequ...

Page 29: ...east half a SCL cycle and then send the R W bit After the MCU sends out the last falling edge of SCLK it must wait for at least half a SCLK cycle and then pull the CSB high To be noticed when reading a register MCU and CMT2300A will have to switch the direction of their IO SDIO between the address bit 0 and the data bit 7 It is required that the MCU switches the IO to input mode before send out th...

Page 30: ...X and RX By configuring the FIFO_RX_TX_SEL to indicate whether it is currently used as TX FIFO or RX FIFO When the two FIFO are not merged users can fill in the TX FIFO while the RX FIFO is used to receive data in the RX mode The FIFO can be accessed via the SPI interface The user can clear the FIFO by setting FIFO_CLR_TXor FIFO_CLR_RX to 1 Also the user can re send the old data in the TX FIFO by ...

Page 31: ...o the FIFO FCSB must be pulled down 1 clock cycle at first and then send the rising edge of SCL After the last falling edge of SCL is sent the MCU must wait at least 2 us to pull up the FCSB Between the adjacent read write operations the FCSB must be pulled high for 4us at least When writing the FIFO the first bit data must be ready 0 5 clock cycles before sending the first rising edge of SCL SCLK...

Page 32: ...0 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 25 24 27 26 29 28 31 30 RX DATA Noise Noise SYNC_OK RX FIFO ARRAY RX_FIFO_OVF FIFO_TH 16 RX_FIFO_WBYTE Figure 13 CMT2300ARX FIFO interrupt timing diagram 1 0 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 25 24 27 26 29 28 31 30 EMPTY FULL TX_FIFO_NMTY TX_FIFO_TH TX_FIFO_FULL Sync 1 0 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 ...

Page 33: ...0 afterword it has to be longer than the crystal inherent settling time The chip stays in IDLE state until the crystal is settled After the crystal is settled the chip perform calibration of each module and stay in SLEEP state after then to wait for initialization configuration by user The chip will back to IDLE state and redo startup steps upon reset at anytime POR VDD POR Release 1 ms XTAL Stabl...

Page 34: ...1 TX 0110 go_stby go_tx go_stby go_sleep go_stby go_rx go_switch go_switch g o _ s t b y g o _ t f s g o _ s t b y g o _ r f s go_tfs go_tx go_rfs go_rx go_tfs go_sleep go_rfs go_sleep go_sleep go_tx go_sleep go_rx Power up Figure 16 State Switch Diagram SLEEP State The chip power consumption is the lowest in SLEEP state and almost all the modules are turned off SPI is open the registers of the co...

Page 35: ...le is off the other modules are turned on and the current will be larger than STBY Because PLL has been locked in the TX frequency TFS cannot switch to RX Switching from STBY to TFS probably requires PLL calibration and stability time of 350us Switching from SLEEP to TFS needs to add the crystal start up and settled time Switching from other state to TFS will be completed immediately RX State All ...

Page 36: ...300A has 2 interrupt ports They can be configured to different GPIO outputs Pin No Name I O Function 16 GPIO1 IO Configured as DOUT DIN INT1 INT2 DCLK TX RX RF_SWT 15 GPIO2 IO Configured as INT1 INT2 DOUT DIN DCLK TX RX RF_SWT 8 GPIO3 IO Configured as CLKO DOUT DIN INT2 DCLK TX RX Interrupt mapping table is as below INT1 and INT2 mapping is the same Take INT1 as an example ...

Page 37: ...e is written to the RX FIFO Itis a pulse Auto RX_FIFO_OVF 01111 indicates RX FIFO is overflow Auto TX_FIFO_NMTY 10000 Indicates that TX FIFO is not empty Auto TX_FIFO_TH 10001 Indicates the number of unread bytes of the TX FIFO is over FIFO TH Auto TX_FIFO_FULL 10010 Indicates TX FIFO is full Auto STATE_IS_STBY 10011 Indicates that the current state is STBY Auto STATE_IS_FS 10100 Indicates that th...

Page 38: ...GPO1_SEL 1 0 GPIO1 0 Preamble OK Interrupt Source 0 Sycn Word OK Interrupt Source 0 Node ID OK Interrupt Source 0 CRC OK Interrupt Source 0 Packet OK Interrupt Source 0 Sleep Timeout Interrupt Source 0 Receive Timeout Interrupt Source INT1_CTL 4 0 RX_ACTIVE 0 RSSI_VLD_FLG 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 其它 STATE_IS_FS STATE_IS_RX RX_ACTIVE D Q 0 1 PKT_DONE_FLG PKT_DONE_...

Page 39: ...or 3 The typicalRX direct mode control sequence for the MCU is 1 Configures GPIOsusing theCUS_IO_SEL register 2 Configures DATA_MODE 0 3 Send the go_rx command 4 Capture the data from DOUT continuously 5 Send the go_sleep go_stby go_rfs command to stop receiving and save the power Tx processing In the direct mode the data to be transmitted is sent directly to the chip from the external MCU by via ...

Page 40: ...Length in front of the Node ID variable packet format Length in the back of the Node ID and fixed packet format Each element in the packet supports flexible configurations as shown below Preamble Sync Word Length Node ID Data CRC Payload CRC 1 2 3 4 5 6 Manchester Whiten FEC 7 4 Manchester Data Only CRC Figure 20 Variable length packet Length in front of Node ID Preamble Sync Word Length Node ID D...

Page 41: ...e go_sleep go_stby go_rfs command to stop the receiving and save the power 6 Clears the packet interrupts using CUS_ INT_CLR1 and CUS_INT_CLR2 registers Tx processing In the packet mode MCU can fill the data in the FIFO in advance in the STBY and TFS state or fill them in the FIFO while the chip sends the data or use the combination of the above two methods The typical Txpacket mode control sequen...

Page 42: ...upon different application requirements All these options are available only when RX_TIMER_EN is set as 1 namely Rx counter is active The core function of SLP Rx is to reduce Rx time to the best during no signal period meanwhile properly extend Rx time during signal existing time then to reach stable Rx with minimum power consumption In general traditional short range wireless transceiver systems ...

Page 43: ..._OK is valid 9 Any one of PREAM_OK or NODE_OK is valid 10 Any one of PREAM_OK or SYNC_OK or NODE_OK is valid 11 Once meet the Rx extended condition during T1 switch to T2 Leave T2 and pass the control authority to MCU as soon as SYNC is detected otherwise exit Rx when T2 timed out RSSI_VLD is valid 12 PREAM_OK is valid 13 RSSI_VLD and PREAM_OK are valid simultaneously The T1 and T2 mentioned in th...

Page 44: ...ed to understand the details just directly export the register contents from the RFPDK Frequency Bank Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Function User does not need to understand the details just directly export the register contents from the RFPDK Data Rate Bank Addr R W Bit 7 Bit 6 Bit 5 RX_PREAM_SIZE 4 0 Bit 4 Bit 3 Bit 2 PREAM_LENG_UNIT Bit 1 Bit 0 Function 0x38 0x39 0x3A 0x3B 0x3...

Page 45: ...deviation and power 0x60 0x6A Control Bank 1 Set by MCU in application not generated by RFPDK To setup chip working state frequency hopping GPIOs and interrupts control 0x6B 0x71 Control Bank 1 Set by MCU in application not generated by RFPDK To read interrupt flags and RSSI value control the FIFO To simplify the operation users should firstly setup all the desired parameters on the RFPDK export t...

Page 46: ...r Sub 1GHz RF Transceiver QFN16 3x3 Tape Reel 1 8 to 3 6V 40 to 85 3 000 Notes 1 E represents extended industrial grade The temperature range is from 40 to 85 Q represents QFN16 packaging R represents tape reel packing MOQ is 3000pcs For more information about product please visit www cmostek com For purchasing or price requirements please contact sales cmostek com or local sales representative ...

Page 47: ...ackaging information is as below D2 E2 b e L D E A A1 c Top View Bottom View Side View 1 1 16 16 Figure 24 16 Pin QFN 3x3 packaging Table 24 16 Pin QFN 3x3 packaging Symbol Size mm Min Max A 0 7 0 8 A1 0 05 b 0 18 0 30 c 0 18 0 25 D 2 90 3 10 D2 1 55 1 75 e 0 50 BSC E 2 90 3 10 E2 1 55 1 75 L 0 35 0 45 ...

Page 48: ...ng description Marking method Laser Pin 1 mark Circle diameter 0 3 mm Font size 0 5 mm right aligned Line 1 marking 300A represents model CMT2300A Line 2 marking represents the internal tracking coding Line 3 marking Date code is assigned by assembly factory Y represents the last digit of the year WW represents working week ...

Page 49: ...015 08 06 0 7 All Initial release for production version 2017 03 22 0 8 All Changed T R to 3 000 pcs Added AN document list Added new RF parameters and curves 2017 08 10 0 9 All Added and changed some performance numbers Changed RSSI descriptions Added POR descriptions Added PJD AFC and CDR descriptions Added receiver Power VS Performance descriptions Changed some characters and figures Detected t...

Page 50: ...med for inaccuracies and specifications within this document are subject to change without notice The material contained herein is the exclusive property of CMOSTEK and shall not be distributed reproduced or disclosed in whole or in part without prior written permission of CMOSTEK CMOSTEK products are not authorized for use as critical components in life support devices or systems without express ...

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