Clevo WA50SFQ, Service Manual

Page: 25 / 102

Disassembly
Overview 2 - 1
2.Disassembly
Chapter 2: Disassembly
Overview
This chapter provides step-by-step instructions for disassembling the WA50SFQ series notebook’s parts and subsystems.
When it comes to reassembly, reverse the procedures (unless otherwise indicated).
We suggest you completely review any procedure before you take the computer apart.
Procedures such as upgrading/replacing the RAM, optical device and hard disk are included in the User’s Manual but are
repeated here for your convenience.
To make the disassembly process easier each section may have a box in the page margin. Information contained under
the figure # will give a synopsis of the sequence of procedures involved in the disassembly procedure. A box with a

lists the relevant parts you will have after the disassembly process is complete. Note : The parts listed will be for the dis-
assembly procedure listed ONLY, and not any previous disassembly step(s) required. Refer to the part list for the previ-
ous disassembly procedure. The amount of screws you should be left with will be listed here also.
A box with a

will also provide any possible helpful information. A box with a

contains warnings.
An example of these types of boxes are shown in the sidebar.

Information

Warning