Data Sheet
© 2008 Cisco Systems, Inc. All rights reserved. This document is Cisco Public Information.
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Figure 2. Cisco 3270 Rugged ISR (photos not to scale)
The Cisco 3230 models consist of a combination of PC/104-Plus mobile interface cards, including
the Mobile Access Router Card (MARC), Serial Mobile Interface Card (SMIC), Fast Ethernet
Switching Mobile Interface Card (FESMIC), Wireless Mobile Interface Card (WMIC), and Mobile
Router Power Card (MRPC). The Cisco 3230 is offered as a card bundle to be placed in a third-
party enclosure or as a complete system in the Cisco 3230 Rugged Enclosure.
The Cisco 3270 models include a larger router card capable of supporting two PC/104-Plus card
stacks. The Cisco 3270 provides expanded interface support, which includes Gigabit Ethernet
copper, fiber, USB, and Fast Ethernet ports. The Cisco 3270 is offered as a standalone router card
for embedded applications or as a complete system in the Cisco 3270 Rugged Enclosure.
The following cards are used with both the Cisco 3230 and 3270 models:
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SMIC: Four synchronous/asynchronous serial ports
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FESMIC: Four Fast Ethernet ports
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WMIC: 802.11a/b/g and 4.9 GHz support
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MRPC: DC/DC power converter card
To learn more about the Cisco 3270 Rugged ISR, see the Cisco 3270 data sheet:
http://www.cisco.com/en/US/prod/collateral/routers/ps272/ps6990/product_data_sheet0900aecd80
4c207b.html
Cisco 3200 Series Rugged Enclosures
Customers can work with system integrators on enclosure solutions or they can choose a rugged
enclosure from Cisco. Cisco provides rugged enclosures for the Cisco 3230 and Cisco 3270
models that address mobility needs for the public safety, transportation, and defense markets.
Manufactured by Cisco, this rugged, sealed enclosure is designed for use in vehicles, trains, or
airplanes. The rugged enclosure is designed and tested to withstand extended temperatures, high
altitude, shock, vibration, and exposure to damp, wet, or dusty environments. The Cisco 3200
Rugged Enclosures provide:
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A rugged design meeting a wide range of environmental specifications, including MIL-STD-
810F, MIL-STD-461E, NEMA 4, and SAE (J1211 and J1455) standards
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A sealed enclosure that uses conductive cooling without the use of internal fans
●
A modular enclosure that offers expansion slots for future growth
