DCC-HD1 Rev.900-785-30-00
©2013 CIS Corporation. All rights reserved.
6
6.
Part Names and Functions
1.
Sensor board (BI-VC01PA)
OLPF and filter case are attached to the sensor board.
Protect the OLPF from dusts.
Has the same serial number as the one on a main board
2.
Main board (MB-VC01)
Mainly provided with on-board FPGA and CPU.
Has the same serial number as the one on a sensor board.
3.
Driver board (PD-VC01)
Mainly provided with on-board 3G-SDI, HD-SDI drive, and power circuit.
Has the same serial number as the one on a sensor board.
4.
FPC (51 pins)
FPCs which connect each board
Boards are connected at the time of delivery.
Sensor board and main board are paired up as the correction data of the sensor is saved in the main board.
5.
Electric power supply, USB I/F connector (10 pins)
Power input (DC+12V) and USB I/F signal.
Connect to the power input and USB using the attached 10 pins cable.
6.
3G-SDI/HD-SDI output connector (BNC)
3G-SDI/HD-SDI video-out signal
Connect to the 3G-SDI/HD-SDI monitor using BNC cable.
7.
DC IRIS LENS connector (4 pins)
Signal for the DC IRIS LENS
Connnect to the DC IRIS LENS using the attached 4 pins cable. No connection is needed when DC IRIS is not
in use.
8.
RS-232C I/F connector (3 pins)
Signal for RS-232C
Connect to the RS-232C using the attached 3 pins cable.
No connection is needed when RS-232C is not in use.
BI-
V
C
01
Bo
a
rd
MB-VC01 Board
PD-VC01 Board
OL
P
F
Filter Case
BNC (3G,HD-SDI OUT)
1
2
3
4
6
5
8
7
CN 1
CN 1
CN 2
CN 3
CN 4
CN 5
CN 1
CN 2
