Cirrus Logic CS2000-OTP, General Description Manual

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CS2000-OTP
28 DS758F3
9. PACKAGE DIMENSIONS
Notes:
1. Reference document: JEDEC MO-187
2. D does not include mold flash or protrusions which is 0.15 mm max. per side.
3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.
4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5. Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
INCHES MILLIMETERS NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.0433 -- -- 1.10
A1 0 -- 0.0059 0 -- 0.15
A2 0.0295 -- 0.0374 0.75 -- 0.95
b 0.0059 -- 0.0118 0.15 -- 0.30 4, 5
c 0.0031 -- 0.0091 0.08 -- 0.23
D -- 0.1181 BSC -- -- 3.00 BSC -- 2
E -- 0.1929 BSC -- -- 4.90 BSC --
E1 -- 0.1181 BSC -- -- 3.00 BSC -- 3
e -- 0.0197 BSC -- -- 0.50 BSC --
L 0.0157 0.0236 0.0315 0.40 0.60 0.80
L1 -- 0.0374 REF -- -- 0.95 REF --
Parameter Symbol Min Typ Max Units
Junction to Ambient Thermal Impedance JEDEC 2-Layer
JEDEC 4-Layer

JA

JA
-
- 170
100 -
- °C/W
°C/W
Junction to Case Thermal Impedance

JC
- 30.2 - °C/W
Junction to Top Thermal Characteristic (Center of Package) Ψ
JT
- 6 - °C/W
10L MSOP (3 mm BODY) PACKAGE DRAWING ( Note 1 )
E
N
1 2 3
e
b
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW

L1
c