MC75i Hardware Interface Description
4.2 Antenna Pad
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MC75i_HD_v01.100a
Page 74 of 122
2009-08-13
Confidential / Released
4.2
Antenna Pad
The antenna can be soldered to the pad, or attached via contact springs. For proper grounding
connect the antenna to the ground plane on the bottom of MC75i which must be connected to
the ground plane of the application.
When you decide to use the antenna pad take into account that the pad has not been intended
as antenna reference point (ARP) for the Cinterion Wireless Module MC75i type approval. The
antenna pad is provided only as an alternative option which can be used, for example, if the
recommended Hirose connection does not fit into your antenna design.
Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a
50
connector is mandatory for type approval measurements. This requires GSM devices with
an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable
with adapter.
Notes on soldering:
•
To prevent damage to the module and to obtain long-term solder joint properties you are
advised to maintain the standards of good engineering practice for soldering.
•
Be sure to solder the antenna core to the pad and the shielding of the coax cable to the
ground plane of the module next to the antenna pad. The direction of the cable is not rele-
vant from the electrical point of view.
MC75i material properties:
MC75i PCB: FR4
Antenna pad: Gold plated pad
4.2.1
Suitable Cable Types
For direct solder attachment, we suggest to use the following cable types:
•
RG316/U 50
coaxial cable
•
1671A 50
coaxial cable
Suitable cables are offered, for example, by IMS Connector Systems. For further details and
other cable types please contact
