BRTRO-420 Drawer Type Reflow Oven Operating Manual
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or time is too long, will cause flux volatile prematurely, and then lead to
oxidation and poor wetting;
Ref
: Reflowing section, this section is mainly used to melt the solder paste,
it’s a key step in welding, temperature rise rate is greater than the previous,
too high temperature and too long time will lead to oxidation and impact of
components on circuit board;
RefKp
: Reflowing keep section, used to set the time to maintain the
maximum temperature for full of flux volatile and solder flow;
Cool
: Cooling section, mainly used to reduce the temperature of the circuit
board smoothly, solder will be re-solidified in this process, it is worth
mentioning that the cooling process also has a great impact on the welding
effect, too fast or too slow cooling process will produce pale and lightless
solder beads, what is worse, there may be potential defects;
Melt
: Melting point, in fact, the solder paste has strict requirements on time
that the temperature above the melting point.
6.7.
Run Page
Select ‘Run’ at the menu page to enter page as below, the buzzer will give out a
long ringing, once entering the run page, machine start run the reflowing curve.
Run
Cur1
03:25
219.5°C
56%
220°C
Item
Type
Description
Run
Display
Indicates that the current screen is run page
219.5°C
Display
Current temperature
Cur1
Display
Current selected curve
03:25
Display
Run time
56%
Display
Percentage of completed
220°C
Display
Theoretical temperature
Curve
Display
Actually measured curve