— 3 —
2-2. CIRCUIT DIAGRAM
✽
1. No
bonding
✽
2.
Shor
t (Solder
ing) (Switching function)
KI6:
Open (No Solder
ing)
KI7:
Open (No Solder
ing)
KI8:
Open (No Solder
ing)
✽
3. Latch
T
ype
K
e
y
✽
4. Shor
t
(Solder
ing)
✽
5. Inclination
sensor
Not mounted in this module
.
✽
6.
Nor
mal High f
or LD1
✽
7.
GNDB is used f
or the bias on the bac
k of the tip
.
✽
8.
Rant1 is not mounted in this module
.
LSI
T
O
T
AL 123PINS
BONDING 81PINS
LCD (2.8V 1/3b 1/5d)
INV
IC
L1
L28
L29
L61
LC1
LC5
SDS
SDC
✽
1
✽
1
✽
1
✽
1
GND
VDD2
BA
T
VCH
VDD3
VC1
VC2
C1
C3
C5
XTB
Xtal1
CT
LD1
S1
S2
S3
VDD1
C2
BD1
C8
LL1
Tr
1
XT
T1
T2
T3
KI1
KI2
KI3
KI4
KI5
KI6
KI7
KI8
KI9
EMP
✽
3
S4
SCR
SCIN
RP1
RP2
Cp
PZ
VDSP
C4
VC3
VC4
Di1
V_TQ
C7
SD
A
SCL
SCUT
AC
T4
D0
KC4
KC3
KC22
KC1
R1
R2
VSC
C6
SC
C9
CLF1
E
’
Cel
EL
LL2
L+
VO
U
T
L-
GND
CLF2
V+
BA
CK
FR
ONT
✽
4
✽
4
SL
PON
O1
O2
O4
O3
✽
1
✽
1
✽
1
✽
8
T5
R3
✽
4
LD2
✽
1
✽
3
✽
3
✽
3
✽
3
✽
3
✽
3
✽
1
VC5
VC6
✽
1
✽
1
Z
SK
VPM
RPM
1
Xtal2
ANT
Rxt2
Di2
R1
An.B
KS
✽
5
Rb
GNDB
✽
7
Rpd
Crh2
Crh1
Crh0
Rant2
Rant1
Creg
Cf12
Cagc
Cf13
Ccp9
Rcp
Cxt
Rxt1
Rbat
Cbat
Crh3
✽
2
✽
2
✽
2
16
2
15
3
14
4
13
5
12
6
11
7
10
8
IN1
IN2
VCC
OUT1
OUT2
GND
REC
DEC1
REG
PON
AG
C
FIL1
FIL2
TCO
HOLD
DEC2
9
