— 11 —
3-2. CIRCUIT DIAGRAM
✽
9.
L28~L30 are used as the static drive pins.
✽
10.
L1~L2 are used as the motor drive pins.
✽
1
1
.
CSB is used as the SCUT
pin.
✽
12.
The EEPROM of this module is write-protected,
therefore is not writable.
When WP
is HIGH, EEPROM is write-protected.
When WP
is LOW
, EEPROM is writable.
✽
1. No
bonding
✽
2. GND-KI7:
Open
(No
Soldering)
✽
3.
Latch type key
✽
4. Short
(Soldering)
(R,
N
trimming)
✽
5. Inclination
sensor
✽
6.
GNDB is used for the bias on the back of the tip.
✽
7. PIN
name
✽
8.
Soldering short after the test
LCD (2.8V 1/3b 1/5d)
GND
VDD2
VCH
VDD3
VC1
V
C2
VDD1
BD
VDSP
VC3
VC4
VHF
VSC
C1
C3
C5
C2
C4
C7
C6
BA
T
C8
LL1
Tr
1
PZ
Di1
SC
C9
Z
Di2
R1
L
CLF1
E'
L+
VOUT
L
–
GND
CLF2
V+
C1
1
EL
LL2
BACK
FRONT
R3
GNDB
ELD
Xtal
CT
S2
SA
S1
S3
SK
S5
S4
XTB
LD1
XT
T1
T2
T3
KI1
KI2
KI3
KI4
KI5
KI6
KI7
KI9
AC
T4
R1
R2
R3
N1
N2
L3 - - - - L55
LC1 - - - LC5
SDO
SCK
CSB
SDI
An.B1
L1
L2
EEPROM
C10
Tr
2
R17
VCCE
SCL
SDA
WP
VSS
A
1
A2
A0
SDA
WP
SCL
V
CC
SCR
SCIN
KI8
KC4
KC3
KC2
KC1
VPM
R5
R4
C12
SDI
SDO
SCK
T1
CSB
T2
TEST
CS
V
A
DX
VREF1
V
ADY
SN5
VTH
VA
N
VREF4
SN6
VREF2
VOS
GND
VDD2
ISNS
IREF1
SN3
S
N4
IREF2
L
1
L
2
VM1
VM2
S
N7
CF
CR
OSC1
OSC3
OSC4
OSC6
C13
RT
H
C14
R6
R7
R8
R9
R10
4
3
2
1
C15
C16
C17
R1
1
R12
R13
Di3
R14
R16
SX
L1
SY
L2
GND
R15
MIS
MIC
LSI (NEW SOI)
TOTAL 106PINS
BONDING 105PINS
LSI2 (Sensor Tip)
TOTAL 36PINS
BONDING 36PINS
✽
3
✽
2
INV
✽
4
✽
4
✽
4
✽
3
✽
3
✽
3
✽
5
+
PS
✽
8
✽
8
✽
8
✽
8
✽
9
✽
7
✽
7
✽
3
✽
10
✽
11
✽
4
✽
4
✽
3
✽
3
✽
1
✽
8
✽
12
✽
6
✽
7
✽
7