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3-2. CIRCUIT DIAGRAM
GND
VDD2
BAT2
VCH
VDD3
VC1
V
C2
C3
C2
C5
XTB
Xtal
L9 - - - 36
LC1 - - - LC5
CT
LCD ( 2.8V 1/3b 1/5d )
LD1
S2
VDD1
C1
BD
C8
LL1
Tr1
XT
T1
T2
T3
KI1
KI2
KI3
KI4
KI5
KI6
KI7
KI8
KI9
SA
SCR
SCIN
RP1
RP2
Cp
PZ
VDSP
C4
VC3
V
C4
Di1
VHF
C6
SDO
S
CK
CSB
AC
T4
KC4
KC3
KC2
KC1
R1
R2
VSC
C7
SC
C9
R3
Z
VPM
Di2
R1
Rb
GNDB
S1
S3
SDI
N1
N2
S4
KS
An.B1
L6 - - L8
L3-5,L37 - - - L55
L1
L2
Cxt
Rxt2
Ccp
Cbat
Rbat
Xtal2
ISB
ANT
Rcp
Rxt3
Xtal3
Cc
FET-S
GND4
Asel
Pon
P3-2
Hold
P14
FET-D
P1
P2
GND3
GND2
P3-1
P4
P5
GND5
P12
P13
GND1
TCO
VCC
P9
P7
Crh1
Crh2
Crh3
Crl1
Crl2
Crl3
VOUT
0
COIL
B
LED
DRIVER
5
ENABLE
4
(N.C.)
3
GND
2
(N.C.)
1
LEDOUT
(N.C.)
A
(N.C.)
9
VDD
8
CE2
7
6
CE1
LED2
Di
LL2
LED1
Rld1
Rld2
Cld1
Cld2
Rpd
BAT1
✽
10
✽
7
✽
4
✽
6
✽
5
✽
6
✽
4
✽
4
✽
3
✽
3
✽
3
✽
3
✽
3
✽
3
✽
9
✽
9
✽
8
✽
11
✽
14
✽
14
✽
14
✽
14
✽
15
✽
14
✽
13
✽
14
✽
12
✽
1
✽
1
✽
1
✽
1
✽
1
✽
3
✽
3
✽
2
✽
2
LSI
TOTAL 106PINS
BONDING 80PINS
✽
1. No
bonding
✽
2.
GND-KI6: Open (No Soldering)
GND-KI7: Open (No Soldering)
✽
3.
Latch type key
✽
4.
Short (Soldering) (R trimming)
✽
5. Inclination
sensor
✽
6.
Short (Soldering) (N trimming)
✽
7.
GNDB is used for the bias on the
back of the tip.
✽
8.
L28~L30 are used as the static drive pins.
✽
9.
Motor drive pins (01, 02 and 03) are used in this module.
✽
10. Normal
Low
✽
1
1.
LD2 (Normal Low) is used in this module.
✽
12.
LD3 (Normal High) is used in this module.
✽
13.
Cxt is not mounted in the specification for dual translmitters.
✽
14.
Cc, Crl1, Crl2, Crl3, Rxt3 and Xtal3 are not mounted in the
specification for single transmitter
.
✽
15.
Rpd is not mounted in the specification whichincludes signal
reception.