Broadcom Proprietary. Not for distribution outside the company
- 2 -
AFBR-39xxyyRZ
Application Note
Application Note
Baking
When the device is inserted and soldered to a PCB up to 1 week
after it has been taken out of the Moisture Barrier Bag, then the
moisture level in the mold material is low enough to ensure
minimum mechanical stress while soldering.
If the device is kept on the production floor for more than
1 week as described in the last paragraph, it is advised to bake
the module before soldering.
Baking is done by removing the devices from the tube and
placing them in a shallow container so that the package bodies
do not touch each other. Then, the devices are placed in the
bake oven, heating the devices to 100°C for 24 hours. After this
procedure, the moisture content of the devices is low and the
moisture-induced stress during soldering is reduced. As a
general guideline, baking is recommended before every
soldering attempt.
The baking procedure can be done as often as necessary.
Electrostatic Discharge (ESD) Protection
The devices are sensitive to electrostatic discharges and
therefore must be handled with care in an ESD protected area,
indicated with the sign shown in
.
Figure 4 Warning Sign for ESD Protected Area
An ESD event may damage or degrade the device
performance. The standard DIN 61340-5-1 has to be
considered. The following ESD preventions should be applied.
Any smaller ESD prevention program might be unsuitable to
prevent ESD damages.
ESD floors
ESD tables, ESD work surfaces and ESD storage facilities
(e.g., trolleys and carts)
ESD wrist straps/connectors for wrist straps
ESD footwear and garments (cotton or special released
materials)
ESD gloves or finger cots
ESD chairs
ESD tools (e.g., nippers)
ESD preventions at equipment parts (Equipment parts
which may directly contact the device leads must be made
of dissipative materials, wherever possible. If dissipative
materials cannot be used for technical reasons metals
must be used whose natural non-conductive surface layer
is sufficiently thin (breakdown voltage <10V). Conducting
machine parts which may contact the device leads directly
must be connected to ground without a series resistor.
ESD packing materials.
ESD Classification
The devices passed the following ESD test: Electrostatic
Discharge to the Electrical Pins Human Body Model (HBM) with
U = ±2000V according MIL-STD-883 Method 3015.
Device Mounting
The devices are designed for through-hole mounting on a PCB.
The minimum distance from the package to the PCB is
mechanically defined by the design of the housing which is
given as drawing in the product data sheet
Solderability/Soldering Process
The qualification test,
Resistance to soldering heat - Standard
soldering technique (RSH-ST)
, was done with a solder
temperature of 260°C for 10 seconds (distance to package:
3 mm) according to JEDEC standard JESD22-B106D.
Hand Soldering/ Rework
Hand soldering or rework is not allowed during production
process.
If hand soldering is necessary, the following guidelines must be
observed:
Heat the devices to 100°C for 24 hours.
Soldering time must be below 350°C and limited to less
than 3 seconds.
Do not allow the lead temperature measured on the lead
close to the mold package to exceed 350°C.
Note: Hand soldering and rework is a badly reproducible
process. Hand soldering may cause stresses in the mold
package, which affects optical performance and/or reliability if
the above guidelines are not observed.
ATTENTION
ESD PROTECTED AREA
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHANGE
SENSITIVE
DEVICES
