Contents
page 4
Beckhoff New Automation Technology
CB4055
5.3.7
Super IO Configuration ....................................................................................................... 53
5.3.8
H/W Monitor ........................................................................................................................ 55
5.3.9
Serial Port Console Redirection.......................................................................................... 57
5.3.10
Network Stack ..................................................................................................................... 59
5.3.11
CPU PPM Configuration ..................................................................................................... 60
5.3.12
Intel(R) GigabitNetworkConnection .................................................................................... 61
5.4
Chipset ........................................................................................................................................ 63
5.4.1
PCH-IO Configuration ......................................................................................................... 64
5.4.2
System Agent (SA) Configuration ....................................................................................... 71
5.5
Boot ............................................................................................................................................. 79
5.5.1
CSM Parameters ................................................................................................................ 81
5.6
Security ....................................................................................................................................... 82
5.6.1
Secure Boot Policy ............................................................................................................. 83
5.6.2
Key Management ................................................................................................................ 84
5.7
Save & Exit ................................................................................................................................. 86
5.8
BIOS-Update .............................................................................................................................. 87
6
Mechanical Drawings ......................................................................................................................... 88
6.1
PCB: Mounting Holes ................................................................................................................. 88
6.2
PCB: Pin 1 Dimensions .............................................................................................................. 89
6.3
PCB: Heat Sink/Die Center ......................................................................................................... 90
7
Technical Data ................................................................................................................................... 91
7.1
Electrical Data ............................................................................................................................. 91
7.2
Environmental Conditions ........................................................................................................... 91
7.3
Thermal Specifications ............................................................................................................... 92
8
Support and Service .......................................................................................................................... 93
8.1
Beckhoff's Branch Offices and Representatives ........................................................................ 93
8.2
Beckhoff Headquarters ............................................................................................................... 93
8.2.1
Beckhoff Support ................................................................................................................ 93
8.2.2
Beckhoff Service ................................................................................................................. 93
I
Annex: Post-Codes ............................................................................................................................ 95
II
Annex: Resources .............................................................................................................................. 96
IO Range ................................................................................................................................................ 96
Memory Range ....................................................................................................................................... 96
Interrupt .................................................................................................................................................. 96
PCI Devices ............................................................................................................................................ 97
SMB Devices .......................................................................................................................................... 97