BCM EMS-TGL, Quick Reference Manual

Page: 11 / 96

Quick Reference Guide
EMS-TGL Series Quick Reference Guide 11
Package vibration
test

1. PSD: 0.026G²/Hz , 2.16 Grms

2. Non-operation mode

3. Test Frequency : 5-500Hz

4. Test Axis : X,Y and Z axis

5. 30 min. per each axis

6. IEC 60068-2-64 Test:Fh
Shock

1. Wave form
：
Half Sine wave

2. Acceleration Rate
：
55g for operation mode

3. Duration Time
：
11ms

4. No. of Shock
：
+/- XYZ axis 18 times

5. Operation mode

6. Reference IEC 60068-2-27 Testing procedures Test Eb : Shock Test
Package Drop Test

1. One corner , three edges, six faces

2. ISTA 2A, IEC-60068-2-32 Test:Ed
IP

IP 50
Operating
Temperature

-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku

0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku
Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing
Storage
Temperature

-40°C ~ 75°C (-40°F ~ 167°F)
Certification

CE, FCC Class B
OS Supported

Win 10 64bit / Linux
Compliant with following Flexible IET Expansion Modules
AUX-M02

4 x LAN supports 2-Pair LAN 2 x USB 2.0
AUX-M04

4 x LAN supports PoE 802.3af + 2 x USB 2.0
EBM-CDVS DB-A

1 x DVI-D + 2 x USB 2.0
EBM-BYTS DB-E

4 x USB 3.0 + 3 x USB 2.0
EBM-BYTS DB-A

1 x HDMI, 2 x RJ45, 2 x RS-232/422/485 (BIOS), 2 x USB 2.0
AUX-M01

4 x RS-232/422/485(BIOS), 2 x USB 2.0
AUX-M07

4 x RS-232/422/485(BIOS) w/ 2.5KV isolation, 2 x USB 2.0
Note:
Specifications are subject to change without notice.