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PB r1.0/Mar. 00

HY29LV800

GENERAL DESCRIPTION

The HY29LV800 is an 8 Mbit, 3 volt-only, CMOS
Flash memory organized as 1,048,576 (1M) bytes
or 524,288 (512K) words that is available in 44-
pin PSOP, 48-pin TSOP and reverse TSOP and
48-ball FBGA packages.  Word-wide data (x16)
appears on DQ[15:0] and byte-wide (x8) data ap-
pears on DQ[7:0].

The HY29LV800 can be programmed and erased
in-system with a single 3 volt V

CC

 supply. Inter-

nally generated and regulated voltages are pro-
vided for program and erase operations, so that
the device does not require a higher voltage V

PP

power supply to perform those functions. The de-
vice can also be programmed in standard EPROM
programmers.  Access times as low as 65 ns over
the full operating voltage range of 2.7 - 3.6 volts
are offered for timing compatibility with the zero
wait state requirements of  high speed micropro-
cessors.  To eliminate bus contention, the
HY29LV800 has separate chip enable (CE#), write
enable (WE#) and output enable (OE#) controls.

The device is compatible with the JEDEC single-
power-supply Flash command set standard. Com-
mands are written to the command register using
standard microprocessor write timings.  They are
then routed to an internal state-machine that con-
trols the erase and programming circuits.  Device
programming is performed a byte/word at a time
by executing the four-cycle Program Command
write sequence. This initiates an internal algorithm
that automatically times the program pulse widths
and verifies proper cell margin.  Faster program-
ming times can be achieved by placing the
HY29LV800  in the Unlock Bypass mode, which
requires only two write cycles to program data in-
stead of four.

The HY29LV800’s sector erase architecture allows
any number of array sectors to be erased and re-
programmed without affecting the data contents
of other sectors. Device erasure is initiated by
executing the Erase Command sequence. This
initiates an internal algorithm that automatically
preprograms the array (if it is not already pro-
grammed) before executing the erase operation.
As during programming cycles, the device auto-
matically times the erase pulse widths and veri-
fies proper cell margin. Hardware Sector Protec-
tion optionally disables both program and erase
operations in any combination of the sectors of

the memory array, while Temporary Sector Un-
protect allows in-system erasure and code
changes in previously protected sectors.  Erase
Suspend enables the user to put erase on hold for
any period of time to read data from, or program
data to, any sector that is not selected for era-
sure. True background erase can thus be
achieved. The device is fully erased when shipped
from the factory.

Addresses and data needed for the programming
and erase operations are internally latched during
write cycles, and the host system can detect
completion of a program or erase operation by
observing the RY/BY# pin, or by reading the DQ[7]
(Data# Polling) and DQ[6] (toggle) status bits.
Hardware data protection measures include a low
V

CC

 detector that automatically inhibits write op-

erations during power transitions.

After a program or erase cycle has been com-
pleted, or after assertion of the RESET# pin (which
terminates any operation in progress), the device
is ready to read data or to accept another com-
mand.  Reading data out of the device is similar to
reading from other Flash or EPROM devices.

Two power-saving features are embodied in the
HY29LV800.  When addresses have been stable
for a specified amount of time, the device enters
the automatic sleep mode.  The host can also place
the device into the standby mode. Power con-
sumption is greatly reduced in both these modes.

Common Flash Memory Interface (CFI)

To make Flash memories interchangeable and to
encourage adoption of new Flash technologies,
major Flash memory suppliers developed a flex-
ible method of identifying Flash memory sizes and
configurations in which all necessary Flash device
parameters are stored directly on the device.
Parameters stored include memory size, byte/word
configuration, sector configuration, necessary volt-
ages and timing information. This allows one set
of software drivers to identify and use a variety of
different, current and future Flash products.  The
standard which details the software interface nec-
essary to access the device to identify it and to
determine its characteristics is the Common Flash
Memory Interface (CFI) Specification.  The
HY29LV800 is fully compliant with this specification.

Summary of Contents for DV323S

Page 1: ...SERVICE MANUAL ECHO VOL DV323S...

Page 2: ...5 1 OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST 4 5 2 BRACKET EXPLOSED VIEW AND PART LIST 6 6 ELECTRICAL CONFIRMATION 8 6 1 VIDEO OUTPUT LUMINANCE SIGNAL CONFIRMATION 8 6 2 VIDEO OUTPUT CHROMINAN...

Page 3: ...removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as alminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only...

Page 4: ...on 9 MIC 1 jack LED display window 14 POWER switch 6 STOP button MIC VOLUME knob 11 8 FWD button IR SENSOR 13 3 OPEN CLOSE button 2 Disc tray 7 REV button 12 ECHO adjustment knob 4 3 11 12 13 14 10 9...

Page 5: ...installation the both ends of the laser diode are short circuited After replacing the parts with new ones remove the short circuit according to the correct procedure See this Technical Guide 2 Do not...

Page 6: ...5 1 Optical pickup Unit Explosed View and Part List Pic 1...

Page 7: ...MIDDLE A 1 7 1EA2511A29400 GEAR MIDDLE B 1 8 1EA2744A03000 SHAFT SLIDE 1 9 1EA2744A03100 SHAFT SLIDE SUB 1 10 1EA2812A15300 SPRING COMP TYOUSEI 3 11 1EA2812A15400 SPRING COMP RACK 1 21 1EA0B10B20100 A...

Page 8: ...t wheel 17 Pick up 5 gearwheel 18 switch 6 iron chip 19 Five pin flat plug 7 Immobility mechanism equipment 20 screw 8 Magnet 21 PCB 9 Platen 22 motor 10 Bridge bracket 23 Motor wheel 11 screw 24 scre...

Page 9: ...h a soldering iron after a circuit is connected Keep the power source of the pick up protected from internal and external sources of electrical noise Refrain from operation and storage in atmospheres...

Page 10: ...onnect the oscilloscope to the video output terminal and terminate at 75 ohms 2 Confirm that luminance signal Y S level is 1000mVp p 30mV Measurement point Video output terminal Color bar 75 PLAY Titl...

Page 11: ...tput terminal and terminate at 75 ohme 2 Confirm that the chrominance signal C level is 621 mVp p 30mV Measurement point Video output terminal Color bar 75 PLAY Title 46 DVDT S15 PLAY Title 12 DVDT S0...

Page 12: ......

Page 13: ...c Erase Algorithm Preprograms and Erases Any Combination of Sectors or the Entire Chip n n n n n Automatic Program Algorithm Writes and Verifies Data at Specified Addresses n n n n n Compliant With Co...

Page 14: ...nd veri fies proper cell margin Hardware Sector Protec tion optionally disables both program and erase operations in any combination of the sectors of the memory array while Temporary Sector Un protec...

Page 15: ...e t i r w e d o m y b d n a t S e h t n i d e c a l p s i e c i v e d E O t u p n I w o L e v i t c a e l b a n E t u p t u O r o f d e t a g e n d n a s n o i t a r e p o d a e r r o f d e t r e s s...

Page 16: ...19 20 DQ3 DQ11 21 22 RY BY A18 1 2 A17 A7 3 4 A10 A11 40 39 A12 A13 38 37 A14 A15 36 35 A16 BYTE 34 33 VSS DQ15 A 1 32 31 DQ7 DQ14 30 29 DQ6 DQ13 28 27 DQ5 DQ12 26 25 DQ4 VCC 24 23 RESET WE 44 43 A8...

Page 17: ...LDQM and UDQM Package 400mil 50 pin TSOP 2 DESCRIPTION ICSI s 16Mb Synchronous DRAM IC42S16101 is organized as a 524 288 word x 16 bit x 2 bank for improved performance The synchronous DRAMs achieve h...

Page 18: ...cept for CKE all inputs to this device are acquired in synchronization with the rising edge of this pin 18 CS Input Pin The CS input determines whether command input is enabled within the device Comma...

Page 19: ...FRESH COUNTER SELF REFRESH CONTROLLER ROW ADDRESS LATCH MULTIPLEXER ROW ADDRESS BUFFER ROW ADDRESS BUFFER COLUMN ADDRESS LATCH BURST COUNTER COLUMN ADDRESS BUFFER ROW DECODER ROW DECODER MEMORY CELL A...

Page 20: ...grates the MediaTek 2nd generation front end analog RF amplifier and the Servo MPEG AV decoder The progressive scan of the MT1389 utilized a proprietary advanced motion adaptive de interlace algorithm...

Page 21: ...output or digital output Embedded Micro controller Built in 8032 micro controller Built in internal 373 and 8 bit programmable lower address port 1024 bytes on chip RAM Up to 4M bytes FLASH programmin...

Page 22: ...e echo Microphone tone control Vocal mute vocal assistant Key shift up to 8 keys Chorus Flanger Harmony Reverb Channel equalizer 3D surround processing include virtual surround and speaker separation...

Page 23: ...GR4 27 GR3 28 GND 29 GR2 30 GR1 31 GND 32 U401 PT6961 LEDAT LEDCK LEDST KEY1 KEY2 KEY3 S1 S2 S3 S4 S5 S6 S7 S8 G1 G2 G3 G4 G5 G6 G7 VCC VCC VCC VCC2 TC402 100uF 16V S1 S2 S3 S4 S5 S6 S7 S8 G1 G2 G3 G...

Page 24: ......

Page 25: ...TC512 47uF 50V TC506 1000uF 10V TC505 1000uF 10V TC509 1000uF 10V TC510 1000uF 10V 2 3 4 1 5 CN501 XS05 D508 HER105 C507 101 TC503 470uF 16V R511 220R 1W FB 4 GND 1 D 2 VCC 3 U501 5L0380R R507 1K R504...

Page 26: ......

Page 27: ...7K R705 75R V701 8050 V702 8050 R708 33R R709 330R R710 2 2K 10V A 10V AGND PDAT0 V703 8050 R711 1K R712 2 2K A 10V PDAT2 C710 104 AGND VCC AGND R707 A 10V AGND AGND VCC PDAT0 10V VGND VGND VGND L712...

Page 28: ......

Page 29: ...1 2 3 VRB02 10K 1 2 3 VRB01 10K MIC MIX OUT2 OUT1 2 3 4 1 5 XSB01 XS05 OUT1 OUT2 MIX MIC GND h B963A 1...

Page 30: ......

Page 31: ......

Page 32: ......

Page 33: ...1 3 GND 4 VDD 8 OUT2 7 IN2 6 IN2 5 U603 TDA1308 R629 3 3K R630 3 3K AGND R636 10K R635 10K C616 101 C617 101 H_R C622 104 NC C621 104 NC 2 3 1 JKA01 PHONEJACK R625 1K R627 56K R626 1K R628 56K AGND AG...

Page 34: ......

Page 35: ...MSO FMSO TRSO FOSO V1P4 L202 33R 89V33 PWR A16 A15 A14 A13 A12 A11 A10 A9 A20 PCE A1 PRD AD0 AD1 AD2 AD3 AD4 AD5 AD6 A21 AD7 A17 A0 V18 VSCK VSDA VSTB SCL SDA RXD TXD URST IR DQM0 DQS0 DQ7 DQ6 DQ5 DQ4...

Page 36: ...5 VCCQ 13 VCCQ 7 VCCQ 38 VCCQ 44 VSSQ 4 VSSQ 10 VSSQ 41 VSSQ 47 VSS 26 VSS 50 NC 37 NC 33 DQML 14 WE 15 DQMH 36 U203 SDRAM 512 16 2 DMA0 DMA1 DMA2 DMA3 DMA4 DMA5 DMA6 DMA7 DMA8 DMA9 DMA10 BA0 SDCLK SD...

Page 37: ...OKA AGND R2156 24K DNS R2136 6 8K R2148 6 8K R2152 6 8K R2153 6 8K R2154 6 8K R2155 6 8K C2122 122 C2129 122 C2130 122 C2133 122 C2135 122 C2136 122 VOICE DET VLS 1 SDIN1 2 SDIN2 3 SDIN3 4 SCLK 5 LRC...

Page 38: ...MIAN SCHEMATIC DIAGRAM 36...

Page 39: ...03 10148 METAL OXIDE FILM RESISTOR 2W120K 5 SHAPE DFLAT 15 7 PCS 1 R502 0070001 HIGH VOLTAGE RESISTOR 1 2W680K 5 PCS 1 R501 0200105 PORCELAIN CAPACITOR 50V 100P 10 5mm PCS 5 C505 C507 C509 C511 C514 0...

Page 40: ...10K 5 0603 PCS 2 R635 R636 0090030 SMD RESISTOR 1 16W 56K 5 0603 PCS 2 R627 R628 0310047 SMD CAPACITOR 50V 101 5 NPO 0603 PCS 2 C616 C617 0310207 SMD CAPACITOR 50V 104 20 X7R 0603 PCS 3 C604 C605 C623...

Page 41: ...4708 PCS 2 L601 L602 0880124 IC NJM4558D DIP PCS 2 U601 U602 0880230 IC PT2399 DIP PCS 1 U603 1562466 PCB 6963A 1 PCS 1 2120807 FLAT CABLE 6P90 2 5 2PLUG WITH L NEEDLE REVERSE PCS 1 XS601 1940024 SOCK...

Page 42: ...PCB 9963 0 PCS 1 1 A DECODE BOARD MATERIAL CODE MATERIAL NAME SPECIFICATIONS UNIT UANTIT LOCATION 0090001 SMD RESISTOR 1 16W 0 5 0603 PCS 30 R201 R204 R212 R222 R228 R234 R236 R245 R247 R251 R255 R257...

Page 43: ...234 C239 C241 C254 C256 C259 C26 7 C274 C279 C282 C301 C3 03 C305 C309 C311 C312 C3 23 C2138 C2143 C2150 C21 52 C2155 C2157 C2160 C216 2 C2164 C2166 C2175 0310058 SMD CAPACITOR 25V 104 80 20 0603 PCS...

Page 44: ...CS 1 U219 0880562 IC 4580 SOP PCS 1 U219 0880361 IC 4558 SOP PCS 1 U219 0880322 IC MM74HCU04M SOP PCS 1 U205 0880513 IC HCU04 SOP PCS 1 U205 0881275 IC IC42S16100 7T SOP PCS 2 U203 U204 0881182 IC LM1...

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