
INTRODUCTION
I-E96-202B
3 - 1
SECTION 3 - INSTALLATION
INTRODUCTION
This section explains what must be done before placing the
multi-function processor module into operation. Read, under-
stand, and complete the steps in the order they appear before
operating the MFP module.
NOTE: To avoid potential module damage, evaluate your system for
compatibility prior to module installation. This module uses connec-
tions to the module mounting unit backplane that served other func-
tions in early Network 90 systems.
Early Network 90 systems applied -30 VDC to pins 3 and 4 of the
module connector P1. This voltage is not required for INFI 90 mod-
ules. In INFI 90 systems, pin 4 is used for the Controlway bus.
If your system contains modules that require -30 VDC, set jumper J5
to the 30 VDC position. Doing so allows the installation of the MFP
module in a module mounting unit that uses -30 VDC and limits
communication to the module bus.
SPECIAL HANDLING
Observe these steps when handling electronic circuitry:
NOTE: Always use Bailey Controls field static kit (part number
1948385_1 - consisting of two wrist straps, ground cord assembly,
alligator clip, and static dissipating work surface) when working with
the modules. The kit is designed to connect the technician and the
static dissipating work surface to the same ground point to prevent
damage to the modules by electrostatic discharge.
1.
Use Static Shielding Bag
. Keep the modules in the static
shielding bag until you are ready to install them in the system.
Save the packaging for future use.
2.
Ground Bags Before Opening
. Before opening a bag con-
taining an assembly with semiconductors, touch it to the
equipment housing or a ground to equalize charges.
3.
Avoid Touching Circuitry
. Handle assemblies by the
edges; avoid touching the circuitry.
4.
Avoid Partial Connection of Semiconductors
. Verify
that all devices connected to the module are properly grounded
before using them.
5.
Ground Test Equipment
.
6.
Use Antistatic Field Service Vacuum
. Remove dust from
the module if necessary.