Microprocessor Module Replacement Kit for H25-IR Infrared Gas Leak Detectors
3015-5575 Rev 0
3
For H25-IR units using firmware
prior to
version 1.4, all system settings and configuration settings will be returned to
factory default values after this upgrade. In such cases, you may choose to manually record your system settings and
configuration values
prior
to
performing this upgrade, and then re-configure those settings afterwards. Regardless, a pre
1.4 upgrade will require at a minimum:
•
Reconfiguration of the IR bench emitter power setting
•
Reconfiguration of the DigiPot setting
•
Reconfiguration of the leak source information (i.e., leak rate and leak temp).
NOTE
: In lieu of using firmware version numbers, you may choose to use the H25-IR serial number (located
on a sticker on the back of the unit) to
estimate
which firmware version your H25-IR has installed (pre 1.4 or
post 1.4). Generally, serial numbers
before
LV1000 are likely to have pre version 1.4 firmware and require
special handling, while serial numbers
after
LV1000 will have firmware version 1.4 or newer. (The exception
to the serial number rule is if you have previously updated your pre version 1.4 firmware to version 1.4
firmware or newer.)
Review the preceding procedure flowchart before beginning the replacement process. Most steps in this microprocessor
board replacement procedure are explained in this document, however, you may need to refer to the H25-IR Instruction
Manual originally shipped with your unit for additional detailed information (e.g., configuring the IR bench’s emitter power,
adjusting the DigiPot, etc.). If you no longer have the manual that shipped with your device, the standard H25-IR manual
may be downloaded from the Bacharach website at
www.mybacharach.com
. If you have any questions, you may contact
Bacharach’s Customer Service Department.
4. Remove the H25-IR’s Top Cover
To gain access to the microprocessor board follow the procedure below.
1.
Unplug the instrument from all power sources (including external batteries if so supplied).
2. Remove both the front and rear bezels by first disengaging the plastic tabs on the right and left sides of the bezel,
and then pulling the bezel straight out.
3. Remove the two top screws that secure the front panel.
4. Remove the Relay, RS-485, and 4–20mA connectors from the rear panel. DO NOT remove any connector on the
interior side of the rear panel.
5. Remove the four screws that secure the rear panel.
6. Drop down the rear panel far enough to allow the top cover to clear, being careful not to stress the cables
attached to the inside of the panel.
7. Remove top cover by
carefully lifting along one edge and releasing the cover from the base unit.
