TX 434 SMALL IA
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Instruction Manual
Technical features are subject to change without notice. AUR°EL S.p.A does not feel responsible for any damage caused by the device’s misuse.
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AUREL S.p.A.
Via Foro dei Tigli, 4 - 47015 Modigliana (FC) – ITALY
Tel.: +39.0546.941124 Fax: +39.0546.941660
http://www.aurelwireless.com
- email:
19/09/2018 - Rev.A
Pag 4 di
9
Soldering and assembling layout SMD
Picture 4:
Recommended layout for Host board
In order to ensure the correct assembly of the module you are required to apply a production process
observing carefully the following recommendations:
Soldering paste: Use soldering paste as SAC305 (96,5% Sn, 3% Ag, 0,5% Cu), with a thickness> 150um.
Assembly: the module can be assembled with automatic machine by using a suction cup tool, applied on
bigger integrated circuit
Soldering: the module can be soldered on host board, through a reflow profile for Lead-free components.
Jedec standard “J-STD-020E”
Standard Jedec “J-STD-020E” defines temperatures and exposure times, is attached below graph and profile
table time / temperature recommended for the purpose.
For host that provide more reflow cycles it is recommended to perform the soldering of the module at the
end of the soldering cycle, taking care to limit excessive vibrations during the terminal phase of reflow
soldering paste.
Profile Feature
Pb-Free Assembly
Preheat/Soak
Temperature Min (T
smin
)
Temperature Max (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
150 °C
200 °C
60-140 seconds
