ATZB-X0-256-4-0-C [ZigBit 900 MHz Wireless Modules]
12
39
PE4/SYNC/OC1A
Master Clock out put
40
PF0
GPIO/Timer
41
DVSS
Digital Ground
42
DVSS
Digital Ground
NOTE: TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module
should follow straight connection for UART.
UART_TXD_external_device <-> UART_TXD
UART_RXD_external_device <-> UART_RXD
3.4
Antenna Orientation Recommendation
TBA
3.5
Mounting information
The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
Figure 3-1. ATZB-X0-256-4-0-CN Dimensions, Mounting Information & Pinout
TBA
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application
3.6
Soldering profile
The J-STD-020C-compliant soldering profile is recommended according to
Table 3-8
.
Table 3-8.
Soldering profile
(1)
.
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note:
1. The package is backward compatible with PB/Sn soldering profile.
