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9120A–AUTO–01/08
ATA6831/ATA6832 Driver ICs
7.
Thermal Considerations
7.1
Cooling Area Design
The IC should be connected to an on-board cooling area. All thermal pins (4 GND pins) as well
as the exposed die pad are directly adapted to the cooling area.
arrangement of the ATA6831’s QFN 4 × 4 mm housing.
The effect of the cooling area on the PCB can be further improved if the bottom side of the PCB
is ground-plated and thermal vias are placed along the cooling area. Some care should be taken
of the copper area’s planarity, in particular, any solder bumps arising at the thermal vias should
be avoided.
Figure 7-1.
Recommended Cooling Area Extension and PCB Pin Layout
ATA6831
1
PCB Top Side
Cooling area
PCB Bottom Side
Cooling area
Thermal Vias
