201
6174B–ATARM–07-Nov-05
AT91FR40162S Preliminary
21.2
Package Drawing
Figure 21-1. AT91FR40162S Package
Table 21-1.
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
Units
θ
JA
Junction-to-ambient thermal resistance
Still Air
121-BGA
6
°
C/W
θ
JC
Junction-to-case thermal resistance
121-BGA
7.3
Table 21-2.
Device and 121-ball BGA Package Maximum Weight
194
mg
Table 21-3.
121-ball BGA Package Characteristics
Ball diameter
0.35 mm
Ball land
0.4 ± 0.05 mm
Solder mask opening
0.3 ± 0.05 mm
Plating material
Copper
Solder ball material
Sn/Ag/Cu
Moisture Sensitivity Level
3