Arbor Technology EmETX-i2304, User Manual

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Preface
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FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.
RoHS
ARBOR Technology Corp. certifies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Haz -
ardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main pur
-
pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava -
lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that ex -
ceed a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is defined
as a substance or mixture of substances with uniform composition (such as sol -
ders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-
96.5%), Ag(3.0-3.5%) and Cu(0.5%)).