10
Aoyue 936A
规格
SPECIFICATION
CONTROL PANEL GUIDE
LEGEND:
1 — Main unit LED
2 — Heater LED
3 — Main power switch
4 — Air level control knob
5 — Temperature control knob
6 — Calibration utility terminal
7 — Hot air gun output
1
2
3
4
5
6
aoyue
6028
SMD REWORK SYSTEM
®
7
15
Aoyue
936 规格
OPERATING GUIDELINES
Stage 4: Cooling
1. The PCB needs to slowly cool down in order to minimize
thermal shock.
2. Gradually elevate the hot air gun to a height of 15cm or half a
foot from the target board. Then remove the hot air gun from
the target device
3. Let PCB cool down .
REMINDER:
1. Height of the tip may be lowered or elevated depending on the type of
solder paste used, and target device size.
2. Lead free solder paste tend to need a higher temperature to reflow .
3. Larger IC packaging may need a longer time before reflow occurs.
4. Plastic components would need a lower temperature to decrease
damage to it.
Stage 2: Flux activating
1. The entire PCB temperature should be around 150 to 160 °C
after stage 1.
2. To activate flux, lower the nozzle of the hot air gun by about
1cm, this would increase the effective temp. to 180200 °C
3. Continue the spiraling motion this time concentrating more on
the devices targeted.
4. Smoke would come out of the solder paste/flux which means
the flux is activated and is doing its work.
5. Continue this motion for 30 to 90 seconds.
Stage 3: Reflow soldering
1. The entire PCB temperature would be around 180 to 200 °C
after performing stage 2.
2. Lower the hot air gun nozzle another 0.5 cm. This would
increase the effective temperature to 220 to 260 °C .
3. Continue the spiraling motion but limit motion on the devices
targeted.
4. The solder paste would now melt and bond with the target
device to the PCB.
5. Normal reflow time is around 30 to 90 seconds.
