To Remove SMD ICs:
1.
Plug the power cord into the power supply.
2.
Turn the power switch on.
3.
Display will show the current temperature, pressing the up and down
temperature settings button will switch the display to the set tempera-
ture, after a few seconds it would revert back to displaying the actual
temperature.
4.
When the airflow is adjusted the display will show the set air flow , it
would revert back to the actual temperature after a few seconds.
5.
Adjust the air flow and temperature , wait for the temperature to sta-
bilize for 30 to 60 seconds.
6.
For your reference, we recommend you to adjust the temperature
around 300 to 350
℃
(For 8032 see reference figure ), and an air
pressure of around 15—30 (For 8032 set to 1-3 ).
7.
Hold the unit so that the nozzle is located over the IC. Move around
the leads of the IC until the solder melts.
8.
Pick up the IC using a vacuum pick up pen or tweezers
9.
Allow ICs and PCB to cool down.
To Solder SMD ICs:
1.
Apply solder paste to the PCB.
2.
Carefully place the IC on the PCB, use tweezers to properly align
the legs of the IC to leads at the PCB .
3.
Preheat PCB and IC together, use a pre-heater for best results .
4.
Wait for the PCB temperature to reach 180 degrees Celsius.
5.
Turn on the unit and set the air pressure to 15(For 8032 set to 1-3 ).
6.
Set hot-air temperature to 350.
7.
Position the nozzle on top of the IC leads, Heat IC’s leads evenly.
8.
Wait for the solder paste to be activated and meld the IC with the
PCB.
OPERATING GUIDELINES
7
Summary of Contents for 8032
Page 2: ......
