52
11. BOM List
Note: The parts information listed below are for reference only, and are subject to change without notice.
Please go to http://cs.tpv.com.cn/hello1.asp for the latest information.
LE32D0330
Location Part
No.
Description
Remark
705TXCBCAD7
705 ASS’Y FOR BRAZIL PCBA
040G 457624 1B
LABEL-CPU
052G 1185
MIDDLE TAPE (Y1200141)
756TXCCB02S2980003
MAIN
BOARD-CBPFC4FSXBC
U409
056G113353A
IC M24C32-WMN6T SO-8 ST
U407 056G1133913
EEPROM
M24C02-WDW6P 2KB TSSOP8
U405
056G2233 43
FLASH H27U2G8F2CTR-BC 2GB TSOP-48
SMTF-U405
100TAKVK005S3X
MCU ASSY-056G2233 43
SMTF-U409 100TAKVK008S3X MCU ASSY-056G113353A
SMTF-U407 100TAKVKV05S1D MCU ASSY-056G1133913
X5
009G6005 1
GND TERMINAL
X6
009G6005 1
GND TERMINAL
CN410
033G3802 3
WAFER 2.0MM 3P
CN407
033G380213B YH
WAFER 2.0MM 13P
CN111
088G 78F151XCL
RCA JACK V/T 11P G/BL/R/W/R 1*5 H=8.6
CN128
088G 78G132AYG
RCA JACK R/A 7P Y/W/R 1*3 H=10.5
CN102
088G302F3G1VYG
PHONE JACK V/T 3P GREEN H=8.4
CN602
088G302G7B1ACL
PHONE JACK R/A 7P BLACK H=10.5
CN602
088G302G7B1AQS
PHONE JACK R/A 7P BLACK H=10.5MM
CN103
088G352F6B2ACL
USB CONN R/A 6P BLACK 8.4MM
CN101
088G353FFF1XCL
D-SUB CONN SCREWED V/T 15P BLUE H=8.6
CN601
311GW250B04DBX
WAFER 2.5MM 4P
CN701 311GW250B13BBX
WAFER 2.5MM 13P R/A 35MM 7MM
TU101
394GNTSC0MN04Y
TUNER BRAZIL SUT-RB211TV
709T50910XM00C
COMSUMPTIVE
ASSY
055G 23520
IPA
055G 23524
WELDING FLUX WITHOUT PB
Q55G 100620500
TIN STICK(SN-0.5AG)
P12G 65011
HEAT PAD
P85T0171101CKD
SHIELD-IC
P90T0066201
HEAT
SINK
U401
056G 562402
SCALER MT5366RVNG PBGA-479
U411
056G 563114
LDO G1117-33T63UF 1A 3.3V SOT-223
U701
056G 563121
LDO G1084-33TU3UF 5A 3.3V TO-263T
U502
056G 563126
LDO G1117T63UF 1A ADJ SOT-223
U113
056G 563126
LDO G1117T63UF 1A ADJ SOT-223
U705
056G 563146
LDO G912T63U 1A 1.2V SOT-223
U415
056G 563227
IC LDO G1084TU3UF 5A/ADJUST TO263T
U703
056G 563344
DC/DC AT1529F11U 3.2A SOP-8
U702
056G 563380
LDO TJ3940S-3.3 1A 3.3V SOT223
U406
056G 575 31
DEMODULATOR CXD2828ER-T4 VQFN-48
U112
056G 581 9
IC G5250K1T1U SOT23-5
U602
056G 593 39
IC STA339BWTR POWERSSO36
U403
056G 615145
DRAM H5TQ1G63DFR-H9C 1GB BGA-96
U402
056G 615145
DRAM H5TQ1G63DFR-H9C 1GB BGA-96
U606
056G 616916
IC MAX9 TQFN-EP-12
U501
056G 634 21
IC SII9185ACTU TQFP-80
U408
056G 643 46
IC RESET AZ809ANSTR-E1 SOT-23 2.93V
Summary of Contents for LE32D0330
Page 4: ...4 1 General Specification Refer to User Manual ...
Page 5: ...5 2 Operating Instructions 2 1 The Use of Remote Control Refer to User Manual ...
Page 6: ...6 2 2 To Use the Menus Refer to User Manual ...
Page 7: ...7 2 3 How to Connect Refer to User Manual ...
Page 8: ...8 2 4 Front Panel Control Knobs Refer to User Manual ...
Page 14: ...14 5 Remove the screws and then remove the LVDS cable to remove the Panel ...
Page 22: ...22 6 PCB Layout 6 1 Main Board 715G5091M01000004K ...
Page 23: ...23 ...
Page 24: ...24 ...
Page 25: ...25 6 2 Power Board 715G5654P01001002M ...
Page 26: ...26 ...
Page 27: ...27 6 3 Key Board 715G5668K01001004S 6 4 IR Board 715G5724R01000004S ...
Page 50: ...50 10 Exploded View ...