ADAV4622
Rev. B | Page 28 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-BEC
1.45
1.40
1.35
0.15
0.05
0.20
0.09
0.10
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
7°
3.5°
0°
61
60
1
80
20
41
21
40
VIEW A
1.60
MAX
0.75
0.60
0.45
16.20
16.00 SQ
15.80
14.20
14.00 SQ
13.80
0.65
BSC
LEAD PITCH
0.38
0.32
0.22
TOP VIEW
(PINS DOWN)
PIN 1
05
170
6-
A
Figure 35. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
SIF Standard
Package Description
Package Option
ADAV4622BSTZ
−40°C to +85°C
PAL/NTSC/SECAM
80-Lead Low Profile Quad Flat Package (LQFP)
ST-80-2
EVAL-ADAV4622EBZ
Evaluation
Board
1
Z = RoHS Compliant Part.
In addition, it is backward compatible with conventional SnPb soldering processes. This means the electroplated Sn coating can be soldered with Sn/Pb solder pastes
at conventional reflow temperatures of 220°C to 235°C.
Purchase of licensed I
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification as defined by Philips.
©2008–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07068-0-7/09(B)
