AS3460
PCB Design
Demo Kit Manual
• PUBLIC
UG000480
• v3-00 • 2021-Nov-08
126
│ 35
Figure 54:
PCB Layout Top Layer
– Components On Single Side, Not All Pins Are Routed
The headphone amplifier are blocks with higher system currents, therefore use wide signal lines for
headphone wires and for the supply. A weak signal line on any of these connections can influence
channel separation of the device.
The ground pins of the AS3460 IC and the external components are directly connected through Vias
to a dedicated ground (GND) plane below this area. The ground plane should be connected to the
battery terminal for best grounding effect.
Figure 55:
PCB Layout GND Layer
– Components On Single Side, Not All Pins Are Routed
