3
1-2
Specification
Spec Description
Design
∗
Micro ATX form factor 4 layers PCB size: 24.4x21.0cm
Chipset
∗
VIA K8M800 North Bridge Chipset
∗
VIA VT8237R Plus South Bridge Chipset
CPU Socket AM2
∗
Support 64bit AMD AM2 940-Pin package utilizes Flip-Chip
Pin Grid Array package compatible processor
∗
Support for HTT 1GHz AMD Athlon 64 X2 processor and
Athlon 64, and HTT 800MHz Sempron Processors
Memory Socket
∗
240-pin DDRII Module socket x 2
∗
Support 2pcs DDRII 800/667/553 / 400 system memory
modules which are expandable to 2.0GB
Expansion Slot
∗
AGP slot x1 support AGP 2.0 & AGP 3.0 for 4X/8X mode
∗
32-bit PCI slot x2
Integrate IDE and
Serial ATA RAID
∗
Two PCI IDE controllers support PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 33/66/100/133 functions that
deliver the data transfer rate up to 133 MB/s; Two Serial ATA
ports provide 150 MB/sec data transfer rate for two Serial ATA
Devices and offer RAID 0 and RAID 1 functions
VGA
∗
Integrated High Performance & High Quality 3D Accelerator
∗
Support Ultra-AGPII with 2GB/s bandwidth
∗
Built-in programmable 24-bit true-color RAMDAC up to
300MHz pixel clock
∗
Programmable frame buffer size from 16MB and up to 64MB.
LAN
∗
Integrated VIA 6103 10 /100 LAN PHY
∗
Supports Fast Ethernet LAN function provide 10Mb / 100Mb /
s data transfer rate
Audio
∗
VIA VT1617A AC’97 Digital Audio controller integrated
∗
6-channel AC’97 Audio CODEC onboard
∗
Audio driver and utility included
BIOS
∗
Award 4MB Flash ROM
Multi I/O
∗
PS/2 keyboard and PS/2 mouse connectors
∗
Floppy disk drive connector x1
∗
Parallel port x1
∗
Serial port x1
∗
VGA port x1
∗
USB2.0 port x 4 and headers x 4 (connecting cable option)
∗
Audio connector (Line-in, Line-out, MIC)