Preliminary Information
AMD Athlon™ 64 and AMD Opteron™ Processors
Thermal Design Guide
26633 Rev.
3.03 September
2003
2) Tape down the thermocouple such that the bead is centered on the package as indicated by
the intersection of the diagonals. Be sure to have the thermocouple oriented to align it
properly with the relief groove in the heatsink as shown in Figure 17.
Figure 17. Thermocouple Taped to Processor Lid
3) Place a slight downward bend in the bare wire near the thermocouple bead. This ensures
optimal thermal contact between the lid and thermocouple.
4) Clean the contact area to achieve good adhesion and apply a small amount of high thermal
conductivity epoxy, such as Omegabond 101, to glue down the thermocouple bead and
about 2 mm of lead wire. This step provides strain relief for the package as shown in
Figure 18 on page 39. Check between the package lid and thermocouple plug for electrical
continuity. Without electrical continuity, good thermal contact is not ensured and the
attachment procedure must be repeated.
5) The heatsink must have a strain relief for the thermocouple bead and wire as shown in
Figure 19 on page 39. A 5-mm diameter hole is machined to a depth of 0.75 to 1.0 mm for
the epoxy bead. A 1.5-mm width slot is machined to a depth of 0.75 mm for the
thermocouple wire.
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Appendix Appendix
A