Preliminary Information
26633 Rev.
3.03 September
2003
AMD Athlon™ 64 and AMD Opteron™ Processors
Thermal Design Guide
A Appendix
This section describes thermocouple instrumentation and the procedure for clip load testing.
A.1 Thermocouple
Instrumentation
Thermocouples measure the three necessary temperatures that are used for a detailed thermal-
performance analysis. The case temperature requires a thermocouple to be attached to the heatsink
lid surface with high thermal conductivity epoxy, such as Omega Engineering’s Omegabond 101.
The heatsink base temperature requires drilling a hole in the heatsink base and inserting a
thermocouple inside the hole. The ambient temperature is measured by fixing a thermocouple with
the bead in the fan inlet air stream 25 mm above the surface of the fan.
A.1.1
Case Thermocouple Attachment
Instructions for attaching the case-temperature thermocouple are as follows:
1) Draw lines on the diagonals of the package as shown in Figure 16. Check that the
intersection lies on the center of the package by using calipers.
Figure 16. Diagonals Marked on Processor to Locate Center
Appendix
A
Appendix
37