1–14
Chapter 1: Overview for the Arria II Device Family
Reference and Ordering Information
Arria II Device Handbook Volume 1: Device Interfaces and Integration
December 2010
Altera Corporation
Reference and Ordering Information
describes the ordering codes for Arria II devices.
Document Revision History
shows the revision history for this document.
Figure 1–3. Packaging Ordering Information for Arria II Devices
Device Density
Package Type
3, 4, 5, or 6, with 3 being the fastest
Corresponds to pin count
17 = 358 pins
25 = 572 pins
29 = 780 pins
35 = 1152 pins
40 = 1517 pins
F: FineLine BGA (FBGA)
U: Ultra FineLine BGA (UBGA)
H: Hybrid FineLine BGA (HBGA)
GX: 45, 65, 95, 125, 190,260
GZ: 225, 300, 350
Optional Suffix
Family S i g n a t u r e
Operating Temperature
Speed Grade
Ball Array Dimension
4
EP2AGX
45
C
17
F
N
Indicates specific device options
N: Lead-free devices
ES: Engineering sample
EP2AGX
EP2AGZ
C
Transceiver Count
C: 4
D: 8
E: 12
F:16
H: 24
C: Commercial temperature (t
J
= 0°C to 85°C)
I: Industrial temperature (t
J
= -40°C to 100°C)
Table 1–10. Document Revision History
Date
Version
Changes
December 2010
4.0
■
Updated for the Quartus II software version 10.0 release
■
Added information about Arria II GZ devices
■
Updated
Table 1–1, Table 1–4, Table 1–5
, and
■
Added
■
Added
■
Updated
■
Updated
and
“Arria II Device Architecture”
section
July 2010
3.0
Updated for the Quartus II software version 10.0 release:
■
Added information about –I3 speed grade
■
Updated Table 1–1, Table 1–3, and Table 1–7
■
Updated Figure 1–2
■
Updated “Highlights” and “High-Speed LVDS I/O and DPA”section
■
Minor text edits
November 2009
2.0
■
Updated Table 1–1, Table 1–2, and Table 1–3
■
Updated “Configuration Features” section
June 2009
1.1
■
Updated Table 1–2.
■
Updated “I/O Features” section.
February 2009
1.0
Initial release.