CX-JN10
33
33
WH230
JW203
R223
R225
R226
R224
JW226
JW225
JW221
FB221
JW216
R221
R222
C250
JW224
JW222
JW223
1-688-400-
15
(15)
5
MAIN BOARD
WH201
E
J221
PHONES
(CHASSIS)
HP BOARD
(AEP, UK)
(EXCEPT AEP, UK)
(EXCEPT AEP, UK)
(AEP, UK)
6-14. PRINTED WIRING BOARD – HP Section –
•
See page 23 for Circuit Boards Location.
:Uses unleaded solder.
6-15. SCHEMATIC DIAGRAM – HP Section –
(Page 32)
WH230
R222
R221
C250
FB221
JW222
JW221
JW225
JW226
R226
R225
J221
R224
R223
5P
2.2k
2.2k
0.47
150
150
∗
∗
(CHASSIS)
L OUT
L-IN
R-IN
R-OUT
GND
PHONES
150
∗
180
R225,226
(AEP
,UK)
(EXCEPT AEP
,UK)
(AEP
,UK)
(EXCEPT AEP
,UK)
(EXCEPT AEP,UK)
(AEP,UK)
(Page 29)
Ref. No.
Location
Ref. No.
Location
D009
F-11
D015
F-10
D016
E-10
D017
F-10
D018
F-10
D019
E-10
D020
E-10
D021
E-10
D022
E-10
D023
H-7
D031
H-8
D032
F-8
D033
F-8
D041
D-9
•
Semiconductor Location – MAIN Board –
Ref. No.
Location
Ref. No.
Location
Ref. No.
Location
Ref. No.
Location
Ref. No.
Location
D042
D-9
D043
D-9
D044
D-9
D045
D-8
D063
F-7
D064
F-7
D065
F-6
D066
F-6
D067
D-8
D068
D-9
D069
F-7
D101
F-4
D103
H-5
D104
G-3
D105
H-4
D106
H-3
D107
G-4
D108
G-3
D109
G-5
D110
G-4
D111
H-6
D231
G-8
D232
G-7
D235
G-7
D236
G-7
D239
G-6
D240
G-7
D241
H-6
D243
G-5
D244
F-5
D281
E-3
D291
F-4
D292
G-4
D301
B-2
D661
C-5
D662
C-5
D663
C-4
D671
F-6
D691
D-7
D692
D-7
D693
D-7
D694
C-6
D695
F-4
D697
B-5
D801
B-7
IC001
H-8
IC002
H-7
IC003
G-8
IC601
C-4
IC672
F-5
JW690
D-6
Q022
D-10
Q023
F-9
Q024
F-8
Q041
D-8
Q043
D-8
Q045
E-9
Q046
E-9
Q047
E-9
Q063
F-7
Q064
F-7
Q101
G-5
Q102
G-3
Q103
G-5
Q104
G-3
Q105
G-5
Q106
G-3
Q107
H-5
Q108
G-3
Q109
H-5
Q110
H-4
Q111
G-6
Q112
G-4
Q117
H-6
Q118
H-4
Q119
H-6
Q120
H-4
Q121
H-6
Q122
H-3
Q123
H-7
Q124
H-4
Q129
H-7
Q130
H-5
Q181
F-4
Q182
F-3
Q183
E-3
Q231
G-7
Q232
F-7
Q233
G-6
Q234
G-6
Q235
G-6
Q281
E-2
Q282
F-2
Q291
F-4
Q292
G-4
Q301
C-3
Q302
D-3
Q303
C-3
Q304
C-3
Q305
C-3
Q306
C-3
Q307
B-3
Q308
B-3
Q309
B-3
Q310
B-2
Q311
C-2
Q312
C-2
Q601
C-3
Ref. No.
Location
Ref. No.
Location