Advantech SOM-6898, User Manual

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SOM-6898 User Manual 10
2.3 Assembly Drawing
These figures demonstrate the assembly order from the thermal module, COM mod-
ule to the carrier board.
Figure 2.5 Assembly Drawing
2.4 Assembly Drawing
Please consider the CPU and chip height tolerance when designing your thermal
solution.
F2=Option1 NOM: 0.315, TOL: ±0.018
Option 2 NOM: 0.415, TOL: ±0.018
F3=Option1 NOM: 0.537, TOL: ±0.07
Option 2 NOM: 0.537, TOL: ±0.07
F4=Option1 NOM: 0.852, TOL: ±0.072
Option 2 NOM: 0.952, TOL: ±0.072
F5=Option1 NOM: 1.08, TOL: ±0.092
Option 2 NOM: 1.18, TOL: ±0.092 (POST SMT STACKUP HEIGHT BASED ON
LIMITED DATA FROM INTEL REFERENCE BOARD DESIGN)
Semi-cooler
Heatspreader
Stand off
Nut
SOM-6898
Carrier Board