3.0
Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials.
A. Disassembly Box module.
A-1. Disassembly 9 pcs screw to remove the MB cover.
A -2. Disassembly 1 pcs screw to remove the Riser card boor.
A -3. Disassembly 2 pcs Antenna rubber.
A -4. Disassembly 5 pcs screw to remove the VESA bracket.
A -5. Disassembly 4 pcs screw to remove the HDD/SSD tray
.
A -6. Disassembly 4 pcs screw to remove the HDD/SSD.
A -7. Disassembly 6 pcs screw to remove the CPU heatsink.
A -8. Disassembly 2 pcs screw to remove the EMI Bracket RAM.
A -9. Disassembly Hex 6pcs from DB9/DB15 port, screw 3pcs from IO bracket to separate the IO bracket.
A -10. Disassembly 1 pcs screw to IO bracket Attachment.
A -11. Disassembly DDR module from DDR socket.
A -12. Disassembly mSATA card (2pcs screw) and Mini PCIe card (2pcs screw) from each socket.
A -13. Remove RTC battery wire cable.
A -14. Disassembly 4 pcs screw to remove the Mother board.
A -15. Disassembly 4 pcs screw to remove the speaker module.
B. Disassembly Panel module.
B -1. Disassembly 3 pcs screw to remove the MB frame.
B-2. Disassembly screw 4pcs to remove the LCD sub-assembly
fro
m Front Bezel.
B-3. Disassembly screw 4pcs to separate the LCD bracket left and right with LCD module.
B-4. Separate the LCD sponge from LCD
op
ening bezel.
B-5. Disassembly screw 1pcs to remove the LED indicator board.
B-6. Remove the waterproof from front bezel.
