Advantech MIC-3666, User Manual

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3 MIC-3666 User Manual
Chapter 1
G
eneral
Information
1.2 Specifications
1.2.1 Ethernet
 Two 10 Gigabit Ethernet channels on the front panel
 SFP+ connectors on the front panel - compatible with Finisar FTLX8571D3BCL
SFP+ transceiver module.
 One Intel® 82599ES Ethernet controller
 Supports PCI Express 2.0 (5 GT/s)
 Supports Intel® Virtualization Technology for Connectivity (VT-c) including Vir-
tual Machine Device Queues
2
(VMDq) and Virtual Machine Direct Connect
(VMDc), which is based on the PCI SIG compliant Single Root I/O Virtualization
(SR-IOV)
 Integrated IPSec & LinkSec security engines
 Implements TCP segmentation offload (TSO), Receive Side Coalescing (RSC),
iSCSI and Fiber Channel over Ethernet (FCoE) offload
 Two LEDs per channel signal both LAN link and activity status
1.2.2 PCI Express
 PCIe x8 interface at 5 Gb/s per lane
 Both lanes on XMC Connector P15
1.2.3 Power Consumption
 +3.3 V, 0.25 A max.
 VPWR (+5 V), 1.5 A max.
1.2.4 Mechanical and Environmental Specifications
 Operating temperature: 0 ~ 55° C (32 ~ 131° F)
 Storage Temperature: -40 ~ 80° C (-40 ~ 176° F)
 Humidity (operating): 95% @ 40° C (non-condensing)
 Humidity (non-operating): 95% @ 60° C (non-condensing)

Board size: 74 x 149 mm (2.9” x 5.78”)
 Weight: 0.104 kg (0.23 lb)
1.2.5 Software Support
 Drivers from Intel
®
for Windows
®
and Linux
1.2.6 Compliance

IEEE Std 1386.1-2001 PMC specification
 VITA 42.0-2005, 42.3-2006 XMC specifications