ADLINK Technology CoreModule 745, Reference Manual

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Chapter 2 Product Overview
8 Reference Manual CoreModule 745
Major Component (ICs) Definitions
Table 2-1 lists the major ICs, including a brief description of each, on the CoreModule 745. Figures 2-3 and
2-4 show the locations of the major ICs.
Table 2-1. Major Component Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U1) Intel Atom N455 or D525 1.67GHz or 1.83GHz
processor with 8-way
L2 cache
Integrates
Processor core
and Graphics
Memory
Controller Hub
I/O Hub (U2) Intel 82801HBM
(ICH8-M) I/O Hub for some
common user
interfaces Provides
Southbridge
interfaces and
off loads some
Northbridge
functions from
the CPU
Gigabit Ethernet
Controller (U4) Intel 82574IT Gigabit Ethernet
controller Generates PCIe
10T/100TX/
1000T Ethernet
signals
PCI-to-ISA Bridge
(U8) ITE ITE8888G-L Interface between PCI
bus and ISA bus Migrates legacy
ISA bus
Super I/O Hub
(U9) SMSC SCH3114I-NU Super I/O controller Provides
complete legacy
Super I/O
functionality
RS-232 Transceiver
(U11 - on bottom
side) [see
Figure 2-4 ]
Analog
Devices ADM213EARSZ Transceiver for Serial 1
and Serial 2 RS-232
signals Transmits and
receives RS-232
signals for
COM1 and
COM2
RS-422/485
Transceiver (U12 -
on bottom side) [see
Figure 2-4 ]
Linear
Technology LTC1334CG Transceiver for Serial 1
and Serial 2 RS-485/
422 signals Transmits and
receives RS-
485/422 signals
for COM1 and
COM2
CPLD (U17 - on
bottom side) [see
Figure 2-4 ]
Xilinx XC9536XL Complex
Programmable Logic
Device (not user
programmable) Provides control
for Power
Sequencing
SPI Flash (U32) - on
bottom side [see
Figure 2-4 ]
Winbond W25Q64BVSSIG Serial Peripheral
Interface Flash
Memory chip (for
firmware) Stores BIOS in
Flash Memory
SSD (Solid State
Drive, U33 - on
bottom side [see
Figure 2-4 ])
Greenliant GLS85LP1004P Industrial-grade,
soldered solid-state
storage module Provides solid
state storage
through the IDE
channel