Thermal Specifications
Chapter:
Technical Data
ADL Embedded Solutions
ADLE3800PC
page 81
7.3 Thermal Specifications
The board is specified to operate in an environmental temperature range from -25°C to +70°C when using
an approved thermal solution, and an extended temperature range of -40°C to +85°C when pre-screened
for use with an approved thermal solution.
Maximum die temperature is 110°C. To keep the processor under this threshold an appropriate cooling
solution needs to be applied. This solution has to take typical and maximum power consumption into
account. The maximum power consumption may be twice as high and should be used as a basis for the
cooling concept. Additional controllers may also affect the cooling concept. The power consumption of
such components may be comparable to the consumption of the processor.
The board design includes thermal solution mounting points that will provide the best possible thermal
interface between die and solution. Since we take thermal solutions seriously we have several advanced,
aggressive cooling solutions in our product portfolio. Please contact your sales representative to order or
discuss your thermal solution needs.
The end customer has the responsibility to ensure that the die
temperature of the processor does not exceed 110°C. Permanent
overheating may destroy the board!
In case the temperature exceeds 110°C the environmental temperature must be reduced. Under
certain circumstances sufficient air circulation must be provided.
The ADLE3800PC includes circuitry that will notify an intelligent power supply to shut down if the
processor reaches a critical temperature. This is achieved by deasserting the (low-active) PS_ON#
signal found on the SM-Bus connector. When PS_ON# is no longer pulled low, an intelligent
power supply would take this as a signal to shut down power. For this to work, PS_ON# must be
connected to the power supply's PS_ON input. If PS_ON# is not otherwise connected, the
ADLE3800PC can be damaged beyond repair if a thermal shutdown event occurs. In rare
instances, if power is not shut down, the board will continue to heat up until failure occurs.
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OTICE